| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Assi, Dani S.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 20242D MXene Interface Engineered Bismuth Telluride Thermoelectric Module with Improved Efficiency for Waste Heat Recoverycitations
- 2023Facile composite engineering to boost thermoelectric power conversion in ZnSb devicecitations
- 2023Facile composite engineering to boost thermoelectric power conversion in ZnSb devicecitations
- 20233D Architectural MXene‐based Composite Films for Stealth Terahertz Electromagnetic Interference Shielding Performancecitations
- 2023Dispersion of InSb Nanoinclusions in Cu<sub>3</sub>SbS<sub>4</sub> for Improved Stability and Thermoelectric Efficiencycitations
- 2023Dispersion of InSb nanoinclusions in Cu3SbS4 for improved stability and thermoelectric efficiencycitations
- 20233D architectural MXene composite films for stealth terahertz shielding performancecitations
- 2022Insights into the classification of nanoinclusions of composites for thermoelectric applicationscitations
- 2022Probing the Effect of MWCNT Nanoinclusions on the Thermoelectric Performance of Cu3SbS4 Compositescitations
- 2022Insights into the Classification of Nanoinclusions of Composites for Thermoelectric Applicationscitations
- 2022Probing the effect of MWCNT nanoinclusions on the thermoelectric performance of Cu3SbS4 compositescitations
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article
Probing the Effect of MWCNT Nanoinclusions on the Thermoelectric Performance of Cu3SbS4 Composites
Abstract
Recently, copper-based chalcogenides, especially sulfides, have attracted considerable attention due to their inexpensive, earth-abundance, nontoxicity, and good thermoelectric performance. Cu<sub style="background-color: rgb(255, 255, 255);">3</sub>SbS<sub style="background-color: rgb(255, 255, 255);">4</sub> is one such kind with p-type conductivity and high phase stability for potential medium-temperature applications. In this article, the effect of a multiwalled carbon nanotube (MWCNT) on the thermoelectric parameters of Cu<sub style="background-color: rgb(255, 255, 255);">3</sub>SbS<sub style="background-color: rgb(255, 255, 255);">4</sub> is studied. A facile synthesis route of mechanical alloying (MA), followed by hot pressing (HP) was utilized to achieve dense and fine-grain samples. Adding the optimal amount of MWCNT nanoinclusions in Cu<sub style="background-color: rgb(255, 255, 255);">3</sub>SbS<sub style="background-color: rgb(255, 255, 255);">4</sub> enhanced the Seebeck coefficient by carrier energy filtering and reduced the thermal conductivity by strong phonon scattering mechanisms. This synergistic optimization helped achieve the maximum figure of merit (<i>ZT</i>) of 0.43 in the 3 mol % MWCNT nanoinclusion composite sample, which is 70% higher than the pristine Cu<sub style="background-color: rgb(255, 255, 255);">3</sub>SbS<sub style="background-color: rgb(255, 255, 255);">4</sub> at 623 K. In addition, enhancement in mechanical stability is observed with the increasing nanoinclusion concentration. Dispersion strengthening and grain boundary hardening mechanisms help improve mechanical stability in the nanocomposite samples. Apart from the enhanced mechanical stability, our study highlights that the incorporation of multiwalled CNT nanoinclusions boosted the thermoelectric performance of Cu<sub style="background-color: rgb(255, 255, 255);">3</sub>SbS<sub style="background-color: rgb(255, 255, 255);">4</sub>, and the same strategy can be extended to other next-generation and conventional thermoelectric materials.