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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Green, Mark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (15/15 displayed)
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2021Investigating conjugated polymer nanoparticle formulations for lateral flow immunoassayscitations
- 2020High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticlescitations
- 2019Anisotropic Plasmonic CuS Nanocrystals as a Natural Electronic Material with Hyperbolic Optical Dispersioncitations
- 2017Post-polymerization C–H Borylation of Donor–Acceptor Materials Gives Highly Efficient Solid State Near-Infrared Emitters for Near-IR-OLEDs and Effective Biological Imagingcitations
- 2015One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2014One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2013Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additivescitations
- 2012Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reactioncitations
- 2012Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substratescitations
- 2011Bond strength of CFRP and steel bars in concrete at elevated temperature
- 2010Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates citations
- 2008Electrical behavior of memory devices based on fluorene-containing organic thin filmscitations
- 2004Self propagating high temperature synthesis of magnesium zinc ferrites (MgxZn1-xFe2O3): Thermal imaging and time resolved X-ray diffraction experimentscitations
Places of action
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article
Anisotropic Plasmonic CuS Nanocrystals as a Natural Electronic Material with Hyperbolic Optical Dispersion
Abstract
<p>Copper sulfide nanocrystals have recently been studied due to their metal-like behavior and strong plasmonic response, which make them an attractive material for nanophotonic applications in the near-infrared spectral range; however, the nature of the plasmonic response remains unclear. We have performed a combined experimental and theoretical study of the optical properties of copper sulfide colloidal nanocrystals and show that bulk CuS resembles a heavily doped p-type semiconductor with a very anisotropic energy band structure. As a consequence, CuS nanoparticles possess key properties of relevance to nanophotonics applications: they exhibit anisotropic plasmonic behavior in the infrared and support optical modes with hyperbolic dispersion in the 670-1050 nm spectral range. We also predict that the ohmic loss is low compared to conventional plasmonic materials such as noble metals in the NIR. The plasmonic resonances can be tuned by controlling the size and shape of the nanocrystals, providing a playground for future nanophotonic applications in the near-infrared.</p>