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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Bastos Da Silva Fanta, Alice
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2023Thermal stability of hierarchical microstructural features in additively manufactured stainless steelcitations
- 2023Study in Phase-Transformation Temperature in Nitinol by In Situ TEM Heating
- 2023The effect of cyclic heat treatment on microstructure evolution during Plasma Arc Additive Manufacturing employing an SEM in-situ heating study
- 2023Probing the Effects of Cyclic Heating in Metal Additive Manufacturing by means of a Quasi in situ EBSD Study
- 2023Study of Phase-transformation Behavior in Additive Manufacturing of Nitinol Shape Memory Alloys by In Situ TEM Heating
- 2022Probing the role of grain boundaries in single Cu nanoparticle oxidation by in situ plasmonic scatteringcitations
- 2022Probing the role of grain boundaries in single Cu nanoparticle oxidation by in situ plasmonic scatteringcitations
- 2022Probing the role of grain boundaries in single Cu nanoparticle oxidation by in situ plasmonic scatteringcitations
- 2022High resolution crystal orientation mapping of ultrathin films in SEM and TEMcitations
- 2021Recent developments for the characterization of crystals and defects at the nanoscale using on-axis TKD in SEM
- 2021Challenges and perspectives of Transmission Kikuchi Diffraction for nanocrystalline materials characterization
- 2020Aminopropylsilatrane Linkers for Easy and Fast Fabrication of High-Quality 10 nm Thick Gold Films on SiO2 Substratescitations
- 2020Aminopropylsilatrane Linkers for Easy and Fast Fabrication of High-Quality 10 nm Thick Gold Films on SiO 2 Substratescitations
- 2019Metal-polymer hybrid nanomaterials for plasmonic ultrafast hydrogen detectioncitations
- 2018Optimal microstructural design for high thermal stability of pure FCC metals based on studying effect of twin boundaries character and network of grain boundariescitations
- 2017Influence of Ti and Cr Adhesion Layers on Ultrathin Au Filmscitations
- 2017Iron Oxide Films Prepared by Rapid Thermal Processing for Solar Energy Conversioncitations
- 2017Time-of-Flight Three Dimensional Neutron Diffraction in Transmission Mode for Mapping Crystal Grain Structurescitations
- 2017Time-of-Flight Three Dimensional Neutron Diffraction in Transmission Mode for Mapping Crystal Grain Structurescitations
- 2013Partial transformation of austenite in Al-Mn-Si TRIP steel upon tensile straining: an in situ EBSD studycitations
- 20093-D Analysis of Graphite Nodules in Ductile Cast Iron Using FIB-SEM
- 2008Three-dimensional EBSD study on the relationship between triple junctions and columnar grains in electrodeposited Co-Ni filmscitations
- 2007Orientation microscopy on nanostructured electrodeposited NiCo-Films
Places of action
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article
Aminopropylsilatrane Linkers for Easy and Fast Fabrication of High-Quality 10 nm Thick Gold Films on SiO2 Substrates
Abstract
Fabricating smooth and contamination-free sub-10 nm thick gold layers on dielectric substrates is of interest for a number of applications, including plasmonics, metamaterials and nanoelectronics. Metallic adhesion layers are often used to facilitate good adhesion between gold and substrates but at the cost of interfacial alloying and subsequent deterioration of the optical and electrical properties of the thin films. Another approach for promoting adhesion between gold and SiO2 substrates is the use of self-assembled organosilane monolayer linkers, such as (3-aminopropyl)¬trimethoxysilane (APTMS). APTMS, however, is a corrosive chemical and its monolayer preparation is highly sensitive to ambient conditions. Here, we introduce an easy and fast immersion process using (3-aminopropyl)-silatrane (APS) for achieving smooth and high-purity gold films and compare its performance to APTMS. Our APS recipe is water based, does not require environmental considerations, and has approximately 6 times faster deposition time than APTMS (30min vs. 3hr). The results demonstrate that both organic molecules promote the formation of continuous and smooth 10 nm thick gold films, without leading to considerable chemical intermixing at the interface. Monitoring the growth evolution of the gold layer indicates a threshold thickness of 6-7 nm for obtaining continuous films. Overall, the ease of use, faster processing time and low toxicity of APS make it an attractive choice for fabricating high-quality ultrathin gold films on SiO<sub>2</sub> substrates.