Materials Map

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (2/2 displayed)

  • 2021Properties of HPT-Processed Large Bulks of p-Type Skutterudite DD0.7Fe3CoSb12 with ZT > 1.310citations
  • 2018Fracture Resistance Enhancement in Hard Mo-B-C Coatings Tailored by Composition and Microstructure12citations

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Mallik, Ramesh Chandra
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Renk, Oliver
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Schafler, Erhard
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Ghosh, Sanyukta
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Rogl, Peter Franz
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Bauer, Ernst
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Grytsiv, Andriy
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Tuomisto, Filip
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2021
2018

Co-Authors (by relevance)

  • Mallik, Ramesh Chandra
  • Renk, Oliver
  • Schafler, Erhard
  • Ghosh, Sanyukta
  • Rogl, Peter Franz
  • Bauer, Ernst
  • Grytsiv, Andriy
  • Tuomisto, Filip
  • Svoboda, Milan
  • Zabransky, Lukas
  • Soucek, Pavel
  • Vasina, Petr
  • Debnarova, Stanislava
  • Perina, Vratislav
  • Bursikova, Vilma
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article

Properties of HPT-Processed Large Bulks of p-Type Skutterudite DD0.7Fe3CoSb12 with ZT > 1.3

  • Mallik, Ramesh Chandra
  • Renk, Oliver
  • Schafler, Erhard
  • Ghosh, Sanyukta
  • Rogl, Peter Franz
  • Bursik, Jiri
  • Bauer, Ernst
  • Grytsiv, Andriy
  • Tuomisto, Filip
Abstract

<p>The influence of shear strain on the microstructural, physical, and mechanical properties was studied on large bulk samples (diameter: 30 mm, thickness: 1 or 8 mm), which were consolidated by high-pressure torsion (HPT) from a commercial powder DD0.7Fe3CoSb12. Particularly, the thick sample (mass similar to 53 g) allowed measuring the thermoelectric (TE) properties with respect to various orientations of the specimen in the sample. All data were compared with those of a hot-pressed (HP) reference sample, prepared with the same powder. Transmission electron microscopy, as well as X-ray powder diffraction profile analyses, Hall measurements, and positron annihilation spectroscopy, supported these investigations. Furthermore, synchrotron data for the temperature range from 300 to 825 K were used to evaluate the changes in the grain size and dislocation density as well as the thermal expansion coefficient via the change in the lattice parameter during heating. In addition, hardness and direct thermal expansion measurements of the HPT samples were performed and compared with the HP reference sample's values. With the increase of the shear strain from the center to the rim of the sample, the electrical resistivity becomes higher, whereas the thermal conductivity becomes lower, but the Seebeck coefficient remained almost unchanged. For the thin as well as thick samples, the enhanced electrical resistivity was balanced out by a decreased thermal conductivity such that the maximum ZT values (ZT = 1.3-1.35 at 856 K) do not vary much as a function of the shear strain throughout the sample, however, all ZTs are higher than that of the HP sample. The thermal-electric conversion efficiencies are in the range of 14-15% (for 423-823 K). With similar high ZT values for the n-type skutterudites, fabricated in the same fast and sustainable way, these p- and n-type skutterudites may serve as legs for TE generators, directly cut from the big HPT bulks.</p>

Topics
  • density
  • grain
  • resistivity
  • grain size
  • hardness
  • positron annihilation lifetime spectroscopy
  • transmission electron microscopy
  • dislocation
  • thermal expansion
  • thermal conductivity