• Nieminen, Tarmo
• Paulasto-Kröckel, Mervi
• Ross, Glenn
• Koskinen, Tomi
• Kornienko, Vladimir

Abstract

<p>Heat accumulation and self-heating have become key issues in microelectronics owing to the ever-decreasing size of components and the move toward three-dimensional structures. A significant challenge for solving these issues is thermally isolating materials, such as silicon dioxide (SiO₂), which are commonly used in microelectronics. The silicon-on-insulator (SOI) structure is a great demonstrator of the limitations of SiO₂ as the low thermal conductivity insulator prevents heat dissipation through the bottom of a device built on a SOI wafer. Replacing SiO₂ with a more thermally conductive material could yield immediate results for improved heat dissipation of SOI structures. However, the introduction of alternate materials creates unknown interfaces, which can have a large impact on the overall thermal conductivity of the structure. In this work, we studied a direct bonded AlN-to-SOI wafer (AlN-SOI) by measuring the thermal conductivity of AlN and the thermal boundary conductance (TBC) of silicon (Si)/AlN and Si/SiO₂/aluminum-oxygen-nitrogen (AlON)/AlN interfaces, the latter of which were formed during plasma-activated bonding. The results show that the AlN-SOI possesses superior thermal properties to those of a traditional SOI wafer, with the thermal conductivity of AlN measured at roughly 40 W m^-1 K^-1 and the TBC of both interfaces at roughly 100 MW m^-2 K^-1. These results show that AlN-SOI is a very promising structure for improving heat dissipation in future microelectronics.</p>

Topics

• impedance spectroscopy
• Oxygen
• aluminium
• Nitrogen
• nitride
• Silicon
• thermal conductivity