• Olausson, Patrik
• Lind, Erik
• Menon, Heera
• Borg, Mattias
• Svensson, Johannes
• Lehmann, Sebastian

Abstract

<p>3D integration of III-V semiconductors with Si CMOS is highly attractive since it allows combining new functions such as photonic and analog devices with digital signal processing circuitry. Thus far, most 3D integration approaches have used epitaxial growth on Si, layer transfer by wafer bonding, or die-to-die packaging. Here we present low-temperature integration of InAs on W using Si3N4 template assisted selective area metal-organic vapor-phase epitaxy (MOVPE). Despite growth nucleation on polycrystalline W, we can obtain a high yield of single-crystalline InAs nanowires, as observed by transmission electron microscopy (TEM) and electron backscatter diffraction (EBSD). The nanowires exhibit a mobility of 690 cm2/(V s), a low-resistive, Ohmic electrical contact to the W film, and a resistivity which increases with diameter attributed to increased grain boundary scattering. These results demonstrate the feasibility for single-crystalline III-V back-end-of-line integration with a low thermal budget compatible with Si CMOS.</p>

Topics

• impedance spectroscopy
• grain
• resistivity
• phase
• mobility
• grain boundary
• transmission electron microscopy
• electron backscatter diffraction
• tungsten
• III-V semiconductor