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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Hatanpää, Timo Tapio
University of Helsinki
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (29/29 displayed)
- 2024Atomic Layer Deposition of Molybdenum Carbide Thin Filmscitations
- 20243D-printed sensor electric circuits using atomic layer depositioncitations
- 2023Conversion of ALD CuO Thin Films into Transparent Conductive p-Type CuI Thin Filmscitations
- 2021Highly conductive and stable Co9S8 thin films by atomic layer depositioncitations
- 2019Atomic layer deposition of tin oxide thin films from bis[bis(trimethylsilyl)amino]tin(II) with ozone and watercitations
- 2019Crystalline tungsten sulfide thin films by atomic layer deposition and mild annealingcitations
- 2019Atomic Layer Deposition of Nickel Nitride Thin Films using NiCl2(TMPDA) and Tert‐Butylhydrazine as Precursorscitations
- 2019Nickel Germanide Thin Films by Atomic Layer Depositioncitations
- 2019Atomic layer deposition of cobalt(II) oxide thin films from Co(BTSA)(2)(THF) and H2Ocitations
- 2019Atomic Layer Deposition of Intermetallic Co3Sn2 and Ni3Sn2 Thin Filmscitations
- 2019Atomic Layer Deposition of PbI₂ Thin Filmscitations
- 2018Diamine Adduct of Cobalt(II) Chloride as a Precursor for Atomic Layer Deposition of Stoichiometric Cobalt(II) Oxide and Reduction Thereof to Cobalt Metal Thin Filmscitations
- 2017Thermal Atomic Layer Deposition of Continuous and Highly Conducting Gold Thin Filmscitations
- 2017Atomic layer deposition of tin oxide thin films from bis[bis(trimethylsilyl)amino]tin(II) with ozone and watercitations
- 2017Atomic Layer Deposition of Crystalline MoS2 Thin Filmscitations
- 2017Studies on Thermal Atomic Layer Deposition of Silver Thin Filmscitations
- 2016Potential gold(I) precursors evaluated for atomic layer depositioncitations
- 2016Atomic Layer Deposition of Metal Phosphates and Lithium Silicates
- 2016Bismuth iron oxide thin films using atomic layer deposition of alternating bismuth oxide and iron oxide layerscitations
- 2014Metal oxide films
- 2012Study of amorphous lithium silicate thin films grown by atomic layer depositioncitations
- 2012Lithium Phosphate Thin Films Grown by Atomic Layer Depositioncitations
- 2011Iridium metal and iridium oxide thin films grown by atomic layer deposition at low temperaturescitations
- 2011Atomic Layer Deposition of GeTe
- 2011Crystal structures and thermal properties of some rare earth alkoxides with tertiary alcoholscitations
- 2009Atomic layer deposition of metal tellurides and selenides using alkylsilyl compounds of tellurium and seleniumcitations
- 2009Alkylsilyl compounds of selenium and tellurium
- 2007Study of a novel ALD process for depositing MgF2 thin filmscitations
- 2007Radical-enhanced atomic layer deposition of silver thin films using phosphine-adducted silver carboxylatescitations
Places of action
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article
Thermal Atomic Layer Deposition of Continuous and Highly Conducting Gold Thin Films
Abstract
Five Au(III) compounds were synthesized and evaluated for atomic layer deposition of Au thin films. One of the compounds, Me<sub>2</sub>Au(S<sub>2</sub>CNEt<sub>2</sub>), showed optimal thermal characteristics while being volatile and thermally stable. In the growth experiments, this compound was applied with O<sub>3</sub> at temperatures of 120–250 °C. Self-limiting growth was confirmed at 180 °C with a rate of 0.9 Å/cycle. The deposited Au thin films were uniform, polycrystalline, continuous, and conductive. Typical resistivity values of 40 nm thick films were 4–16 μΩ cm, which are low for chemically deposited thin films. The chemical composition of a Au thin film deposited at 180 °C was analyzed by time-of-flight elastic recoil detection analysis, proving the film was pure with small amounts of impurities. The detected impurities were O (2.9 atom %), H (0.9 atom %), C (0.2 atom %), and N (0.2 atom %).