| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Flynn, David
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2023Role of interface in optimisation of polyamide-6/Fe3O4 nanocomposite properties suitable for induction heating.citations
- 2023Role of interface in optimisation of polyamide-6/Fe3O4 nanocomposite properties suitable for induction heatingcitations
- 2022Quantification of wear in glass reinforced epoxy resin composites using surface profilometry and assessing effect of surfacing film involvementcitations
- 2021A Review of Sensing Technologies for Non-Destructive Evaluation of Structural Composite Materialscitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2018Nanocomposite-Based Microstructured Piezoresistive Pressure Sensors for Low-Pressure Measurement Rangecitations
- 2018Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radarcitations
- 2018Copper electroplating of PCB interconnects using megasonic acoustic streamingcitations
- 2018A digitally-driven Hybrid Manufacturing process for the flexible production of engineering ceramic components
- 2017Analysis of geomaterials using frequency-modulated continuous wave radar in the K-band
- 2016Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industrycitations
- 2014Integration of Microfluidic Channels with Frequency Selective Surfaces for Sensing and Tuningcitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streamingcitations
- 2013Microstructure formation in a thick polymer by electrostatic-induced lithographycitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streamingcitations
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2011Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications
- 2011Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications
- 2010Influence of pulse reverse plating on the properties of Ni-Fe thin filmscitations
- 2010Bespoke interconnect technologies for optoelectronic and biomedical products
- 2009Design, fabrication, and characterization of flip-chip bonded microinductorscitations
- 2009Design methodology and fabrication process of a microinductor for the next generation of DC-DC power converterscitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2006Assessment of microinductors for DC-DC converters
Places of action
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article
Copper electroplating of PCB interconnects using megasonic acoustic streaming
Abstract
In this research experimental and simulated analysis investigates the influence of megasonic (MS; 1 ± 0.05 MHz) acoustic-assisted electroplating techniques, with respect to the fabrication of through-hole via (THV) and blind-via (BV) interconnects for the Printed Circuit Board (PCB) industry. MS plating of copper down THV and BV interconnects was shown to produce measurable benefits such as increased connectivity throughout a PCB and cost savings. More specifically, a 700% increase of copper plating rate was demonstrated for THVs of 175 µm diameter and depth-to-width aspect ratio (ar) of 5.7:1, compared with electrodeposition under no-agitation conditions. For BVs, a 60% average increase in copper thickness deposition in 150 µm and 200 µm, ar 1:1, was demonstrated against plating under standard manufacturing conditions including bubble agitation and panel movement. Finite element modelling simulations of acoustic scattering revealed 1st harmonic influence for plating rate enhancement.