Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Roy, Sudipta

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University of Strathclyde

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (25/25 displayed)

  • 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloys2citations
  • 2022Modelling the scaling-up of the nickel electroforming process6citations
  • 2022Characteristics of anode materials for nickel electroforming5citations
  • 2021Pulse electrodeposition of copper in the presence of a corrosion reaction7citations
  • 2020Effect of water on the electrodeposition of copper from a deep eutectic solvent42citations
  • 2019Investigation of water absorption profile of mineral wool insulationcitations
  • 2019Electrodeposition of Fe-Sn from the chloride-based electrolyte3citations
  • 2019Electroforming of large scale nickel structures for leading-edge energy, aerospace and marine applicationscitations
  • 2018Anodic reactions and the corrosion of copper in deep eutectic solvents22citations
  • 2018Pt-Ni Subsurface Alloy Catalysts45citations
  • 2018Electrodeposition of Cu from a water-containing deep eutectic solventcitations
  • 2018Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gap5citations
  • 2017The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solventscitations
  • 2017Pulse plating of copper from deep eutectic solvents9citations
  • 2017Electrodeposition of copper from deep eutectic solvents by using pulse currentcitations
  • 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solventcitations
  • 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solventcitations
  • 2016Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approach2citations
  • 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method3citations
  • 2015A soluble molecular variant of the semiconducting silicondiselenide37citations
  • 2015The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid1citations
  • 2015Codeposition of Cu-Sn from ethaline deep eutectic solvent29citations
  • 2014Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gap35citations
  • 2014Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES48citations
  • 2012Pulse Platingcitations

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Green, Todd
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Andreou, Eleni
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Tambe, Christine Enowmbi
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Su, X.
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Valverde Armas, Priscila Estefania
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Edet, John
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Kautek, W.
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Hansal, W.
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Mann, R.
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Zajkoska, S. Mrkonjić
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Coleman, Simon J.
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Su, Xiaomeng
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Silva-Martínez, S.
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Serrà, Albert
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Vallés, Elisa
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Vilana, Joan
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Roesky, Herbert W.
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Linser, Rasmus
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Chandra Mondal, Kartik
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Koley, Debasis
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Dutta, Sayan
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Vasa, Suresh Kumar
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Maity, Bholanath
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Ghosh, Swatilekha
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Coleman, S.
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Hansal, Wolfgang E. G.
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Reichenbach, Andreas
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Leisner, Peter
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Co-Authors (by relevance)

  • Green, Todd
  • Andreou, Eleni
  • Tambe, Christine Enowmbi
  • Su, X.
  • Valverde Armas, Priscila Estefania
  • Edet, John
  • Kautek, W.
  • Hansal, W.
  • Mann, R.
  • Zajkoska, S. Mrkonjić
  • Hariharan, Seenivasan
  • Tiwari, Ashwani K.
  • Coleman, Simon J.
  • Bucko, Mihael
  • Bajat, Jelena B.
  • Su, Xiaomeng
  • Valverde, Priscila
  • Silva-Martínez, S.
  • Serrà, Albert
  • Vallés, Elisa
  • Gómez, Elvira
  • Vilana, Joan
  • Roesky, Herbert W.
  • Linser, Rasmus
  • Chandra Mondal, Kartik
  • Dittrich, Birger
  • Koley, Debasis
  • Dechert, Sebastian
  • Dutta, Sayan
  • Vasa, Suresh Kumar
  • Maity, Bholanath
  • Pewnim, Naray
  • Ghosh, Swatilekha
  • Coleman, S.
  • Hansal, Wolfgang E. G.
  • Reichenbach, Andreas
  • Leisner, Peter
OrganizationsLocationPeople

article

Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gap

  • Roy, Sudipta
  • Coleman, Simon J.
Abstract

This work describes the design and testing of an ultrasonic reactor suitable for processes which require agitation within a narrow gap in a tank geometry. A maskless microfabrication process was used to validate the ultrasonic reactor design. This mask-less electrodeposition method requires the inter-electrode distance between the anode tool and the cathode substrate to be maintained at 300 μm, and sufficient stirring of the electrolyte by ultrasound agitation. A design was proposed allowing 74 mm x 105 mm size substrates to be mounted into an electrode holder and loaded into an 18 L ultrasonic reactor. Experiments were carried out to test the uniformity of the mass transfer within the narrow electrode gap at different locations on the substrate, and to validate the feasibility of a mask-less metal plating technique by depositing features of μm-scale. When increasing ultrasonic powers from 30 to 60 W L-1, increasing agitation was observed at the centre of the substrate, but not at its edges. A Sherwood number correlation showed developing turbulence within the narrow gap, even in the centre of the plate. Micron scale features were plated onto A7 substrates, but the deposited features were 2.5 times the original width. The work showed that sonic streaming can produce sufficient agitation in long sub millimetre channels which can be employed to overcome mass transfer limitations.

Topics
  • experiment
  • laser emission spectroscopy
  • copper
  • ultrasonic
  • electrodeposition