| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Desmulliez, Mpy
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (49/49 displayed)
- 2023Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coatingcitations
- 2022Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallizationcitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2020Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systemscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Photolithographic nanoseeding method for selective synthesis of metal-catalysed nanostructurescitations
- 2019Miniaturized 3-D Cross-Type Receiver for Wirelessly Powered Capsule Endoscopycitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018Nanocomposite-Based Microstructured Piezoresistive Pressure Sensors for Low-Pressure Measurement Rangecitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2016Progress towards a multi-modal capsule endoscopy device featuring microultrasound imagingcitations
- 2016Carbon screen-printed electrodes on ceramic substrates for label-free molecular detection of antibiotic resistancecitations
- 2016A wafer mapping technique for residual stress in surface micromachined filmscitations
- 2015Electrodeposited magnetostrictive Fe-Ga alloys for miniaturised actuatorscitations
- 2015Microwave and thermal curing of an epoxy resin for microelectronic applicationscitations
- 2015Computational electrohydrodynamics in the fabrication of hollow polymer microstructurescitations
- 2015Fabrication of electrodeposited Ni-Fe cantilevers for magnetic MEMS switch applicationscitations
- 2014Characterization and Development of Materials for an Integrated High-Temperature Sensor Using Resistive Test Structures
- 2014Integration of Microfluidic Channels with Frequency Selective Surfaces for Sensing and Tuningcitations
- 2014Statistical analysis of stencil technology for wafer-level bumpingcitations
- 2013Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresistcitations
- 2013Microstructure formation in a thick polymer by electrostatic-induced lithographycitations
- 2012On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substratescitations
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2011Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications
- 2011Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications
- 2011Hermetic glass frit packaging in air and vacuum with localized laser joiningcitations
- 2010An additive method for photopatterning of metals on flexible substratescitations
- 2010Influence of pulse reverse plating on the properties of Ni-Fe thin filmscitations
- 2010Bespoke interconnect technologies for optoelectronic and biomedical products
- 2010Silver nanocluster formation using UV radiation for direct metal patterning on polyimidecitations
- 2010High-aspect-ratio metal microchannel plates for microelectronic cooling applicationscitations
- 2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographycitations
- 2009Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling platecitations
- 2009Design, fabrication, and characterization of flip-chip bonded microinductorscitations
- 2009Design methodology and fabrication process of a microinductor for the next generation of DC-DC power converterscitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2008Adaptive packaging solution for a microlens array placed over a micro-UV-LED arraycitations
- 2008Design methodology and manufacture of a microinductorcitations
- 2008Megasonic enhanced electrodepositioncitations
- 2008Open-ended microwave oven for flip-chip assemblycitations
- 2008Megasonic enhanced wafer bumping process to enable high density electronics interconnectioncitations
- 2006Assessment of microinductors for DC-DC converters
- 2004Design, manufacture and testing of a low-cost micro-channel cooling device
- 2004Design, manufacture and testing of a low-cost micro-channel cooling device
Places of action
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article
Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs
Abstract
The deposition of increased volumes of Cu down an interconnect through-hole via (THV) of a Printed Circuit Board (PCB) is highly desirable for the fabrication of increasing component density and PCB stacks. A quality metric, called micro-throwing power, characterises the volume of Cu that can be deposited within a THV. In this paper, we analyse the influence of 1 ± 0.05 MHz megasonic (MS) assisted agitation applied to copper (Cu) electroplating baths on the micro-throwing ability of a standard, non-filling Cu electroplating solution. Our results indicate that megasonic agitation is shown to increase the Cu deposition volume within a THV by 45% for an increase of MS pressure from 225 W to 450 W, highlighting the significance of acoustic pressure as a key parameter to control MS THV plating volume. Bulk fluid flow rate within a 500 L plating tank is shown to increase by 150% due to Eckhart acoustic streaming mechanisms, compared to existing bath agitation techniques and panel movement. From MS plating experiments and COMSOLTM finite element acoustic scattering simulations, transducer orientation is shown to influence plating performance, with higher-order acoustic resonant modes forming within THVs identified as the cause. Simulations indicate that higher potential acoustic energy was coupled into a 0.200 mm diameter THV cavity, width-to-length aspect ratio (ar): 8:1, than a larger cavity of diameter 0.475 mm, ar 3.4:1. The maximum acoustic energy coupled into THV cavity is observed for a wavefront propagating along the axis of the cavity entrance, indicating an ideal alignment for the MS plating setup.