| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Flynn, David
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2023Role of interface in optimisation of polyamide-6/Fe3O4 nanocomposite properties suitable for induction heating.citations
- 2023Role of interface in optimisation of polyamide-6/Fe3O4 nanocomposite properties suitable for induction heatingcitations
- 2022Quantification of wear in glass reinforced epoxy resin composites using surface profilometry and assessing effect of surfacing film involvementcitations
- 2021A Review of Sensing Technologies for Non-Destructive Evaluation of Structural Composite Materialscitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2018Nanocomposite-Based Microstructured Piezoresistive Pressure Sensors for Low-Pressure Measurement Rangecitations
- 2018Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radarcitations
- 2018Copper electroplating of PCB interconnects using megasonic acoustic streamingcitations
- 2018A digitally-driven Hybrid Manufacturing process for the flexible production of engineering ceramic components
- 2017Analysis of geomaterials using frequency-modulated continuous wave radar in the K-band
- 2016Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industrycitations
- 2014Integration of Microfluidic Channels with Frequency Selective Surfaces for Sensing and Tuningcitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streamingcitations
- 2013Microstructure formation in a thick polymer by electrostatic-induced lithographycitations
- 2013Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streamingcitations
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2011Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications
- 2011Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications
- 2010Influence of pulse reverse plating on the properties of Ni-Fe thin filmscitations
- 2010Bespoke interconnect technologies for optoelectronic and biomedical products
- 2009Design, fabrication, and characterization of flip-chip bonded microinductorscitations
- 2009Design methodology and fabrication process of a microinductor for the next generation of DC-DC power converterscitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2006Assessment of microinductors for DC-DC converters
Places of action
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article
Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs
Abstract
The deposition of increased volumes of Cu down an interconnect through-hole via (THV) of a Printed Circuit Board (PCB) is highly desirable for the fabrication of increasing component density and PCB stacks. A quality metric, called micro-throwing power, characterises the volume of Cu that can be deposited within a THV. In this paper, we analyse the influence of 1 ± 0.05 MHz megasonic (MS) assisted agitation applied to copper (Cu) electroplating baths on the micro-throwing ability of a standard, non-filling Cu electroplating solution. Our results indicate that megasonic agitation is shown to increase the Cu deposition volume within a THV by 45% for an increase of MS pressure from 225 W to 450 W, highlighting the significance of acoustic pressure as a key parameter to control MS THV plating volume. Bulk fluid flow rate within a 500 L plating tank is shown to increase by 150% due to Eckhart acoustic streaming mechanisms, compared to existing bath agitation techniques and panel movement. From MS plating experiments and COMSOLTM finite element acoustic scattering simulations, transducer orientation is shown to influence plating performance, with higher-order acoustic resonant modes forming within THVs identified as the cause. Simulations indicate that higher potential acoustic energy was coupled into a 0.200 mm diameter THV cavity, width-to-length aspect ratio (ar): 8:1, than a larger cavity of diameter 0.475 mm, ar 3.4:1. The maximum acoustic energy coupled into THV cavity is observed for a wavefront propagating along the axis of the cavity entrance, indicating an ideal alignment for the MS plating setup.