| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Jones, Thomas David Arthur
University of Dundee
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2024Demonstration of a high-performance continuous casting process for cobalt alloy ASTM F75
- 2022Inkjet printing of high-concentration particle-free platinum inkscitations
- 2021Phase Field & Monte Carlo Potts Simulation of Grain Growth and Morphology of Vertically Upwards Cast Oxygen Free Copper
- 2021Optimising Computational Fluid Dynamic Conditions for Simulating Copper Vertical Castingcitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018Copper electroplating of PCB interconnects using megasonic acoustic streamingcitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2017Enhanced electrodeposition for the filling of micro-vias
- 2016Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industrycitations
Places of action
| Organizations | Location | People |
|---|
article
Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs
Abstract
The deposition of increased volumes of Cu down an interconnect through-hole via (THV) of a Printed Circuit Board (PCB) is highly desirable for the fabrication of increasing component density and PCB stacks. A quality metric, called micro-throwing power, characterises the volume of Cu that can be deposited within a THV. In this paper, we analyse the influence of 1 ± 0.05 MHz megasonic (MS) assisted agitation applied to copper (Cu) electroplating baths on the micro-throwing ability of a standard, non-filling Cu electroplating solution. Our results indicate that megasonic agitation is shown to increase the Cu deposition volume within a THV by 45% for an increase of MS pressure from 225 W to 450 W, highlighting the significance of acoustic pressure as a key parameter to control MS THV plating volume. Bulk fluid flow rate within a 500 L plating tank is shown to increase by 150% due to Eckhart acoustic streaming mechanisms, compared to existing bath agitation techniques and panel movement. From MS plating experiments and COMSOLTM finite element acoustic scattering simulations, transducer orientation is shown to influence plating performance, with higher-order acoustic resonant modes forming within THVs identified as the cause. Simulations indicate that higher potential acoustic energy was coupled into a 0.200 mm diameter THV cavity, width-to-length aspect ratio (ar): 8:1, than a larger cavity of diameter 0.475 mm, ar 3.4:1. The maximum acoustic energy coupled into THV cavity is observed for a wavefront propagating along the axis of the cavity entrance, indicating an ideal alignment for the MS plating setup.