| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Chodun, Rafał
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2021Synthesis of Copper Nitride Layers by the Pulsed Magnetron Sputtering Method Carried out under Various Operating Conditionscitations
- 2021The Microstructure and Properties of Carbon Thin Films on Nanobainitic Steelcitations
- 2020Design of pulsed neon injection in the synthesis of W-B-C films using magnetron sputtering from a surface-sintered single powder cathodecitations
- 2020Surface sintering of tungsten powder targets designed by electromagnetic discharge: A novel approach for film synthesis in magnetron sputteringcitations
- 2019Plasmochemical investigations of DLC/WCx nanocomposite coatings synthesized by gas injection magnetron sputtering techniquecitations
- 2019Influence of annealing on electronic properties of thin AlN films deposited by magnetron sputtering method on silicon substratescitations
- 2018Relation between modulation frequency of electric power oscillation during pulse magnetron sputtering deposition of MoNx thin filmscitations
- 2018Phase composition of copper nitride coatings examined by the use of X-ray diffraction and Raman spectroscopycitations
- 2018Structure and electrical resistivity dependence of molybdenum thin films deposited by dc modulated pulsed magnetron sputteringcitations
- 2017Reactive sputtering of titanium compounds using the magnetron system with a grounded cathodecitations
- 2017Multi-sided metallization of textile fibres by using magnetron system with grounded cathodecitations
- 2016Determination of sp 3 fraction in ta-C coating using XPS and Raman spectroscopy
- 2016Titanium nitride coatings synthesized by IPD method with eliminated current oscillationscitations
- 2010Structure of Fe-Cu coatings prepared by the magnetron sputtering method
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article
Reactive sputtering of titanium compounds using the magnetron system with a grounded cathode
Abstract
This article presents a study of the reactive deposition of coatings by the Pulsed Magnetron Sputtering method with reversely biased electrodes, where the cathode is sputtered at ground potential and an anode, separated from the magnetron body, is positively biased. The reactive sputtering of grounded cathodes occurs by glow discharge plasma localization at the surface of the cathode enhanced by a magnetic field. Our study compares the process of coating deposition running at standard for a magnetron sputtering method with an electrode arrangement which is reversely biased. Processes of coating deposition were carried out in various mixtures of sputtering and reactive oxygen/nitrogen gases. The structure and phase composition of TiO2 and TiN coatings were examined. In the case of the magnetron system with reversed electrodes biasing we spotted the tendency of nucleation in the rutile phase in the structure of TiO2 coatings. TiN coatings deposited by this version of magnetron sputtering were characterized by better stoichiometry. We believe that a specific electric field distribution for the magnetron system with a grounded cathode strongly affects the mechanism of synthesis which enhances the reactivity, and thermodynamically stabilizes phases characterized by high barriers of nucleation.