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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Sandberg, Henrik G. O.
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Publications (9/9 displayed)
- 2014Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablationcitations
- 2009Organic thin film transistor gate dielectrics by utilization of different aluminium oxide growth methods
- 2008Fabrication of thin-film organic memory elements
- 2008Polymer Field-Effect Transistors
- 2007Metallic nanoparticles in a polymeric matrix
- 2007Towards printable organic field-effect transistors based on poly(3, 3’’’-didodecyl quarter thiophene) utilizing a crosslinkable gate dielectric layer
- 2007Metallic nanoparticles in a polymeric matrix:Electrical impedance switching and negative differential resistance
- 2005A novel method to orient semiconducting polymer filmscitations
- 2004The influence of lipophilic additives on the emeraldine base-emeraldine salt transition of polyanilinecitations
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article
Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablation
Abstract
We present roll-to-roll printing compatible techniquesfor manufacturing organic thin film transistors using twoseparately processed foils that are laminated together.The introduction of heat-assisted lamination opens uppossibilities for material and processing combinations.The lamination of two separately processed substratestogether will allow usage of pre-patterned electrodes onboth substrates and materials with non-compatiblesolvents. Also, the surface microstructure is formeddifferently when laminating dry films together comparedto film formation from liquid phase. Demonstratortransistors, inverters and ring oscillators were producedusing lamination techniques. Finally, a roll-to-rollcompatible lamination concept is proposed where also thesource and drain electrodes are patterned by laserablation. The demonstrator transistors have shown verygood lifetime in air, which is contributed partly to thegood material combination and partly to the enhancedinterface formation in heat-assisted lamination process.