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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Kroger, Roland
University of York
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2016Semiconductor-Metal Nano-Floret Hybrid Structures by Self-Processing Synthesiscitations
- 2013Microstructural evolution and nanoscale crystallography in scleractinian coral spherulitescitations
- 2013Formation and Structure of Calcium Carbonate Thin Films and Nanofibers Precipitated in the Presence of Poly(Allylamine Hydrochloride) and Magnesium Ionscitations
- 2011An artificial biomineral formed by incorporation of copolymer micelles in calcite crystalscitations
- 2008Interaction of Stacking Faults in Wurtzite a-Plane GaN on r-Plane Sapphire
- 2008The role of anisotropy for defect properties in a-plane GaN
- 2008The role of anisotropy for the defect properties in a-plane GaN - art. no. 689403
- 2007On the mechanism of dislocation and stacking fault formation in a-plane GaN films grown by hydride vapor phase epitaxy
- 2007Defect structure of a-plane GaN grown by hydride and metal-organic vapor phase epitaxy on r-plane sapphirecitations
- 2006The versatility of hot-filament activated chemical vapor depositioncitations
- 2006Anti-diffusion barriers for gold-based metallizations to p-GaN
- 2006TEM analyses of wurtzite InGaN islands grown by MOVPE and MBEcitations
- 2006Anisotropic spatial correlation of CdSe/Zn(S)Se quantum dot stacks grown by MBEcitations
- 2006Surface segregation of Si and Mg dopants in MOVPE grown GaN films revealed by X-ray photoemission spectro-microscopycitations
- 2005Surfactant-mediated epitaxy of Ge on Si(111)citations
- 2005Microstructure of highly p-type doped GaN sub-contact layers for low-resistivity contacts
- 2004Determination of the anisotropic optical properties for perfluorinated vanadyl phthalocyanine thin filmscitations
- 2004Microstructural study of quantum well degradation in ZnSe-based laser diodes
- 2002On the way to the II-VI quantum dot VCSELcitations
- 2002Plasma induced microstructural, compositional, and resistivity changes in ultrathin chemical vapor deposited titanium nitride filmscitations
Places of action
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article
The versatility of hot-filament activated chemical vapor deposition
Abstract
In the field of activated chemical vapor deposition (CVD) of polycrystalline diamond films, hot-filament activation (HF-CVD) is widely used for applications where large deposition areas are needed or three-dimensional substrates have to be coated. We have developed processes for the deposition of conductive, boron-doped diamond films as well as for tribological crystalline diamond coatings on deposition areas up to 50 cm x 100 cm. Such multi-filament processes are used to produce diamond electrodes for advanced electrochemical processes or large batches of diamond-coated tools and parts, respectively. These processes demonstrate the high degree of uniformity and reproducibility of hot-filament CVD. The usability of hot-filament CVD for diamond deposition on three-dimensional substrates is well known for CVD diamond shaft tools. We also develop interior diamond coatings for drawing dies, nozzles, and thread guides. Hot-filament CVD also enables the deposition of diamond film modifications with tailored properties. In order to adjust the surface topography to specific applications, we apply processes for smooth, fine-grained or textured diamond films for cutting tools and tribological applications. Rough diamond is employed for grinding applications. Multilayers of fine-grained and coarse-grained diamond have been developed, showing increased shock resistance due to reduced crack propagation. Hot-filament CVD is also used for in situ deposition of carbide coatings and diamond-carbide composites, and the deposition of non-diamond, silicon-based films. These coatings are suitable as diffusion barriers and are also applied for adhesion and stress engineering and for semiconductor applications, respectively. (c) 2006 Elsevier B.V. All rights reserved.