| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Panchenko, Juliana
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024Laboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Opticscitations
- 2023Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applicationscitations
- 2023Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integrationcitations
- 2022Corrosion study on Cu/Sn-Ag solid-liquid interdiffusion microbumps by salt spray testing with 5 wt.% NaCl solutioncitations
- 2022Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integrationcitations
- 2022Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermographycitations
- 2020Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testingcitations
- 2020Low temperature solid state bonding of Cu-In fine-pitch interconnects
- 2020Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Ballscitations
- 2020Grain Structure Analysis of Cu/SiO2Hybrid Bond Interconnects after Reliability Testingcitations
- 2019Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stackingcitations
- 2018Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Ballscitations
- 2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integrationcitations
- 2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumpscitations
- 2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposercitations
- 2014Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnectscitations
- 2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffractioncitations
- 2012Effects of bonding pressure on quality of SLID interconnectscitations
- 2011The creep behaviour and microstructure of ultra small solder jointscitations
- 2011Solidification processes in the Sn-rich part of the SnCu systemcitations
- 2010Microstructure Characterization Of Lead‐Free Solders Depending On Alloy Compositioncitations
- 2010The scaling effect on microstructure and creep properties of Sn-based solderscitations
- 2010Metallographic preparation of the SnAgCu solders for optical microscopy and EBSD Investigationscitations
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article
Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermography
Abstract
This study introduces the application of infrared (IR) thermography for the determination of melting and solidification temperatures of Sn-Ag-Cu based solder materials commonly used for interconnects in electronic components and devices. The presented setup allows a fast and simultaneous analysis with heating and cooling rates of approx. 0.93 K/s and 0.74 K/s respectively. In order to prove feasibility, measurements were carried out on free standing solder spheres with a diameter of 270 µm which is a typical size for solder interconnects in electronic devices. Four Sn-Ag-Cu alloys (Sn-2.0Ag-0.5Cu, Sn-3.0Ag-0.25Cu, Sn-3.0Ag-0.7Cu, Sn-3.0Ag-0.5Cu) with 19 samples per alloy were investigated per experimental run, resulting in a total of 76 samples per measurement. The reproducible extraction of the respective onset temperatures for melting and solidification is demonstrated by the analysis of representative heating and cooling graphs. The onset temperature of melting, which represents the eutectic temperature of these alloys, was measured between 215.1 °C and 218.1 °C. This is less accurate but in good agreement with additionally conducted Differential Scanning Calorimetry (DSC) measurements (217.2 °C to 218.0 °C), as well as the eutectic temperature from the phase diagram (217.2 °C). The solidification temperature of these samples was statistically evaluated by four subsequent experimental runs (generating up to 76 values per alloy). The measured temperature range combined for all four alloys was between 127.2 °C and 196.4 °C. The DSC results (nine values per alloy; three samples; three runs) are comparable but yield a smaller range from 142.2 °C to 185.2 °C. Furthermore, the melting and solidification temperatures of small Sn-Ag FlipChip solder bumps (approx. ∅ 87 µm) were reproducibly analyzed by the IR thermography method and range from 220.3 °C to 220.5 °C and 176.3 °C to 196.7 °C respectively. The presented IR thermography method has proven a valuable alternative, especially for a statistical analysis of undercooling distributions in small samples, such as Sn-Ag-Cu solder joints.