Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Technical University of Denmark

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (6/6 displayed)

  • 2024Nanoimprinted Polymeric Structured Surfaces for Facilitating Biofilm Formation of Beneficial Bacteriacitations
  • 2019Influence of chlorides and phosphates on the antiadhesive, antibacterial, and electrochemical properties of an electroplated copper-silver alloy4citations
  • 2018An electroplated copper–silver alloy as antibacterial coating on stainless steel53citations
  • 2017Genome-wide-analyses of Listeria monocytogenes from food-processing plants reveals clonal diversity and dates the emergence of persisting sequence types51citations
  • 2003Influence of surface roughness of stainless steel on microbial adhesion and corrosion resistance235citations
  • 2003Covalent Attachment of Poly(ethylene glycol) to Surfaces, Critical for Reducing Bacterial Adhesion320citations

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Chart of shared publication
Liu, Yuyan
1 / 1 shared
Sternberg, Claus
1 / 1 shared
Schift, Helmut
1 / 9 shared
Kempen, Paul
1 / 1 shared
Taboryski, Rafael
1 / 7 shared
Ferrer-Florensa, Xavier
1 / 1 shared
Kilstrup, Mogens
1 / 1 shared
Møller, Per
2 / 47 shared
Ciacotich, Nicole
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Sloth, Jens Jørgen
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Din, Rameez Ud
1 / 24 shared
Worning, Peder
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Westh, Henrik
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Nielsen, Jesper Boye
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Marvig, Rasmus Lykke
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Ng, Yin
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Knudsen, Gitte Maegaard
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Hilbert, Lisbeth Rischel
1 / 21 shared
Bagge-Ravn, Dorthe
1 / 1 shared
Kold, John
1 / 1 shared
Gadegaard, Nikolaj Hølledig
1 / 1 shared
Kingshott, Peter
1 / 9 shared
Wei, Jiang
1 / 2 shared
Bagge, Dorthe
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2019
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Co-Authors (by relevance)

  • Liu, Yuyan
  • Sternberg, Claus
  • Schift, Helmut
  • Kempen, Paul
  • Taboryski, Rafael
  • Ferrer-Florensa, Xavier
  • Kilstrup, Mogens
  • Møller, Per
  • Ciacotich, Nicole
  • Sloth, Jens Jørgen
  • Din, Rameez Ud
  • Worning, Peder
  • Westh, Henrik
  • Nielsen, Jesper Boye
  • Marvig, Rasmus Lykke
  • Ng, Yin
  • Knudsen, Gitte Maegaard
  • Hilbert, Lisbeth Rischel
  • Bagge-Ravn, Dorthe
  • Kold, John
  • Gadegaard, Nikolaj Hølledig
  • Kingshott, Peter
  • Wei, Jiang
  • Bagge, Dorthe
OrganizationsLocationPeople

article

An electroplated copper–silver alloy as antibacterial coating on stainless steel

  • Møller, Per
  • Sloth, Jens Jørgen
  • Gram, Lone
  • Din, Rameez Ud
  • Ciacotich, Nicole
Abstract

Transfer and growth of pathogenic microorganisms must be prevented in many areas such as the clinical sector. One element of transfer is the adhesion of pathogens to different surfaces and the purpose of the present study was to develop and investigate the antibacterial efficacy of stainless steel electroplated with a copper-silver alloy with the aim of developing antibacterial surfaces for the medical and health care sector. The microstructural characterization showed a porous microstructure of electroplated copper-silver coating and a homogeneous alloy with presence of interstitial silver. The copper-silver alloy coating showed active corrosion behavior in chloride-containing environments. ICP-MS measurements revealed a selective and localized dissolution of copper ions in wet conditions due to its galvanic coupling with silver. No live bacteria adhered to the copper-silver surfaces when exposed to suspensions of S. aureus and E. coli at a level of 10<sup>8</sup> CFU/ml whereas 10<sup>4</sup> CFU/cm<sup>2</sup> adhered after 24 h on the stainless steel controls. In addition, the Cu-Ag alloy caused a significant reduction of bacteria in the suspensions. The coating was superior in its antibacterial activity as compared to pure copper and silver electroplated surfaces. Therefore, the results showed that the electroplated copper-silver coating represents an effective and potentially economically feasible way of limiting surface spreading of pathogens.

Topics
  • porous
  • impedance spectroscopy
  • microstructure
  • surface
  • stainless steel
  • silver
  • corrosion
  • copper
  • interstitial
  • inductively coupled plasma mass spectrometry
  • silver alloy