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| Naji, M. |
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| Ertürk, Emre |
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| Bih, L. |
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| Casati, R. |
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| Azam, Siraj |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Musca, Charles
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Publications (8/8 displayed)
- 2009Low temperature N2-based passivation technique for porous silicon thin filmscitations
- 2007Dielectric thin films for MEMS-based optical sensorscitations
- 2006Stress in low-temperature plasma enhanced chemical vapour deposited silicon nitride thin filmscitations
- 2005Characterization of Mechanical Properties of Silicon Nitride Thin Films for MEMS Devices by Nanoindentation
- 2005Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry-Perot optical filterscitations
- 2005Evaluation of Plasma Deposited Silicon Nitride Thin Flims for Microsystems Technologycitations
- 2004Laser-Beam-Induced Current Mapping of Spatial Nonuniformities in Molecular Beam Epitaxy As-Grown HgCdTecitations
- 2004Dark Currents in Long Wavelength Infrared HgCdTe Gated Photodiodescitations
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article
Low temperature N2-based passivation technique for porous silicon thin films
Abstract
A technique is presented for the passivation of porous silicon (PS) thin films via nitrogen based annealing at the lowest temperature ever reported. Annealing freshly anodized PS thin films at temperatures as low as 520 ∘C under N2 flow in a rapid thermal annealer produces films that show no change in refractive index when exposed to ambient conditions over 60 days. These films also exhibited chemical resistance by surviving a brief dip in both concentrated KOH and buffered HF. Unlike most other PS surface passivation methods, this technique causes negligible reduction in refractive index of the annealed PS thin films. Passivation only occurs when dangling bonds and mono-hydrides populate the PS surface, providing a path for thermal interactions with the N2 gas.