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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Khuri-Yakub, Butrus T.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2013Integrated Circuits for Volumetric Ultrasound Imaging With 2-D CMUT Arrayscitations
- 2013A Comparison Between Conventional and Collapse-Mode Capacitive Micromachined Ultrasonic Transducers in 10-MHz 1-D Arrayscitations
- 2012Volumetric Real-Time Imaging Using a CMUT Ring Arraycitations
- 2012Deep Tissue Photoacoustic Imaging Using a Miniaturized 2-D Capacitive Micromachined Ultrasonic Transducer Arraycitations
- 2011Chemical Vapor Detection Using a Capacitive Micromachined Ultrasonic Transducercitations
- 20103-D Deep Penetration Photoacoustic Imaging with a 2-D CMUT Array.
- 2009Three-Dimensional Photoacoustic Imaging Using a Two-Dimensional CMUT Arraycitations
- 2009An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imagingcitations
- 2009Wafer-Bonded 2-D CMUT Arrays Incorporating Through-Wafer Trench-Isolated Interconnects with a Supporting Framecitations
- 2008Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imagingcitations
- 2007Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrayscitations
- 2007Finite element modeling and experimental characterization of crosstalk in 1-D CMUT arrayscitations
- 20063-D ultrasound imaging using a forward-looking CMUT ring array for intravascular/intracardiac applications
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article
Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays
Abstract
This paper presents a method to provide electrical connection to a 2D capacitive micromachined ultrasonic transducer (CMUT) array. The interconnects are processed after the CMUTs are fabricated on the front side of a silicon wafer. Connections to array elements are made from the back side of the substrate via highly conductive silicon pillars that result from a deep reactive ion etching (DRIE) process. Flip-chip bonding is used to integrate the CMUT array with an integrated circuit (IC) that comprises the front-end circuits for the transducer and provides mechanical support for the trench-isolated array elements. Design, fabrication process and characterization results are presented. The advantages when compared to other through-wafer interconnect techniques are discussed.