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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Kočí, Jan | Prague |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Santos, Gil Nonato C.
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article
Negative differential resistance in polymer tunnel diodes using atomic layer deposited, TiO2 tunneling barriers at various deposition temperatures
Abstract
<p>Atomic layer deposition (ALD) presents a method to deposit uniform and conformal thin-film layers with a high degree of control and repeatability. Quantum functional devices that provide opportunities in low-power molecular and organic based memory and logic via thin metal-oxide tunneling layer were previously reported by Yoon et al. [1]. Demonstrated here area polymer tunnel diodes (PTD) with high negative differential resistance (NDR) using an ALD deposited tunneling layer grown between 250 °C – 350 °C. A critical relationship between deposition temperature, oxygen vacancy concentration and room temperature NDR is presented. In this work, for a TiO<sub>2</sub> deposition temperature of 250 °C, the peak NDR voltage position (V<sub>peak</sub>) and associated peak current density (J<sub>peak</sub>) are ∼4.3 V and −0.14 A/cm<sup>2</sup>, respectively, with a PVCR as high as 1.69 while operating at room temperature. The highest PVCR recorded was 4.89 ± 0.18 using an ALD deposition temperature of 350 °C. The key advantages of the ALD process used in fabrication of PTDs are increased repeatability and manufacturability.</p>