| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Marques-Hueso, Jose
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2023Upconversion 3D printing enhancement via silver sensitization to enable selective metallizationcitations
- 2023Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coatingcitations
- 2022Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallizationcitations
- 2022Routes towards manufacturing biodegradable electronics with polycaprolactone (PCL) via direct light writing and electroless platingcitations
- 2020Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systemscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Photolithographic nanoseeding method for selective synthesis of metal-catalysed nanostructurescitations
- 2019Selective Metallization of 3D Printable Thermoplastic Polyurethanescitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2014Physical performance limitations of luminescent down-conversion layers for photovoltaic applicationscitations
- 2013Enhanced up-conversion for photovoltaics using 2D photonic crystalscitations
- 2012Optical properties of lanthanide dyes for spectral conversion encapsulated in porous silica nanoparticles
- 2012Nanoplasmonics for photovoltaic applicationscitations
- 2012Plasmon dumping in Ag-nanoparticles/polymer composite for optical detection of amines and thiols vaporscitations
Places of action
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article
Upconversion 3D printing enhancement via silver sensitization to enable selective metallization
Abstract
This work presents the synergistic effect of silver (Ag) ions to enhance the crosslinking of 3D printing photopolymers via near-infrared (NIR) to ultraviolet (UV)/visible light upconversion (UC) and allow selective metallization of multi-material parts. By incorporating a commercial micron-sized ytterbium-thulium co-doped sodium yttrium fluoride phosphor (NaYF4:Yb3+, Tm3+) into a photopolymer resin, a low-cost NIR laser is used to initiate curing exactly at the focal point in the depth of the vat, allowing voxel crosslinking in any point of the space at a depth in the centimeter scale, beyond the traditional layer-by-layer 2D scheme. This allows the printing with the presented resin on pre-existing printed parts, which is the basis for multi-material integration in 3D printing, beyond the 2D limitation. The addition of Ag(I) ions in the photopolymer enables improved photo-curing at 10-fold faster speeds, after printing through 10 mm of resin. In our approach, after the 3D printing process, the Ag(I) ions embedded into the photopolymer serve as seeding sites for electroless copper (Cu) plating, which allows the integration of metalized parts on different substrates, such as glass and 3D printed polymer. Finally, selective copper plating has enabled the manufacture of objects with metal (copper) and plastic (acrylic) surfaces.