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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Wagenaars, Erik
University of York
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2020Influence of surface materials on the volume production of negative ions in a radio-frequency driven hydrogen plasmacitations
- 2019Analysis of plasma enhanced pulsed laser deposition of transition metal oxide thin films using medium energy ion scatteringcitations
- 2016Mechanisms behind surface modification of polypropylene film using an atmospheric-pressure plasma jetcitations
- 2011Heating of high energy density plasmas using EUV and x-ray laserscitations
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article
Analysis of plasma enhanced pulsed laser deposition of transition metal oxide thin films using medium energy ion scattering
Abstract
In this study, plasma-enhanced pulsed laser deposition (PE-PLD), which is a novel variant of pulsed laser deposition that combines laser ablation of metal targets with an electrically-produced oxygen plasma background, has been used for the fabrication of ZnO and Cu<sub>2</sub>O thin films. Samples prepared using the PE-PLD process, with the aim of generating desirable properties for a range of electrical and optical applications, have been analysed using medium energy ion scattering. Using a 100 keV He<sup>+</sup> ion beam, high resolution depth profiling of the films was performed with an analysis of the stoichiometry and interface abruptness of these novel materials. It was found that the PE-PLD process can create stoichiometric thin films, the uniformity of which can be controlled by varying the power of the inductively coupled plasma. This technique showed a high deposition rate of ∼0.1 nm s<sup>−1</sup>.<br/>