Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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1.080 Topics available

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977 Locations available

693.932 PEOPLE
693.932 People People

693.932 People

Show results for 693.932 people that are selected by your search filters.

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PeopleLocationsStatistics
Naji, M.
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Pasanen, Toni P.

  • Google
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Helsinki Institute of Physics

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (21/21 displayed)

  • 2023Surface passivation of Germanium with ALD Al2O3: Impact of Composition and Crystallinity of GeOx Interlayer6citations
  • 2023Excellent Responsivity and Low Dark Current Obtained with Metal-Assisted Chemical Etched Si Photodiode4citations
  • 2023Comparison of SiNx-based Surface Passivation Between Germanium and Silicon9citations
  • 2023Plasma-enhanced atomic layer deposited SiO2 enables positive thin film charge and surface recombination velocity of 1.3 cm/s on germanium5citations
  • 2023Quantifying the Impact of Al Deposition Method on Underlying Al2O3/Si Interface Quality2citations
  • 2022Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE and Fs-Laser Etching32citations
  • 2022Millisecond-Level Minority Carrier Lifetime in Femtosecond Laser-Textured Black Silicon11citations
  • 2022(oral talk) Compatibility of Al-neal in processing of Si devices with Al2O3 layercitations
  • 2022Impact of doping and silicon substrate resistivity on the blistering of atomic-layer-deposited aluminium oxide9citations
  • 2021Efficient photon capture on germanium surfaces using industrially feasible nanostructure formation13citations
  • 2021Al-neal Degrades Al2O3 Passivation of Silicon Surface3citations
  • 2020Modeling Field-effect in Black Silicon and its Impact on Device Performance10citations
  • 2020Passivation of Detector-Grade Float Zone Silicon with Atomic Layer Deposited Aluminum Oxide12citations
  • 2020Impact of doping and silicon substrate resistivity on the blistering of atomic-layer-deposited aluminium oxide9citations
  • 2019Effect of MACE Parameters on Electrical and Optical Properties of ALD Passivated Black Silicon28citations
  • 2019Compatibility of 3-D Printed Devices in Cleanroom Environments for Semiconductor Processing16citations
  • 2019Compatibility of 3-D Printed Devices in Cleanroom Environments for Semiconductor Processing16citations
  • 2019Passivation of Detector‐Grade FZ‐Si with ALD‐Grown Aluminium Oxide12citations
  • 2018Economic Advantages of Dry-Etched Black Silicon in Passivated Emitter Rear Cell (PERC) Photovoltaic Manufacturing29citations
  • 2018Economic Advantages of Dry-Etched Black Silicon in Passivated Emitter Rear Cell (PERC) Photovoltaic Manufacturing29citations
  • 2017Surface passivation of black silicon phosphorus emitters with atomic layer deposited SiO2/Al2O3 stacks34citations

Places of action

Chart of shared publication
Lehtiö, Juha Pekka
2 / 2 shared
Isometsä, Joonas
4 / 6 shared
Liu, Hanchen
3 / 7 shared
Kokko, K.
1 / 6 shared
Vähänissi, Ville
17 / 43 shared
Savin, Hele
21 / 75 shared
Leiviskä, Oskari
3 / 8 shared
Laukkanen, P.
1 / 9 shared
Fung, Tsun Hang
3 / 5 shared
Miettinen, Mikko
2 / 5 shared
Rad, Zahra Jahanshah
2 / 2 shared
Liu, Xiaolong
3 / 13 shared
Radfar, Behrad
3 / 9 shared
Setälä, Olli E.
4 / 4 shared
Serue, Michael
1 / 2 shared
Heinonen, Juha
2 / 2 shared
Chen, Kexun
5 / 7 shared
Yli-Koski, Marko
2 / 7 shared
Laukkanen, Pekka
2 / 11 shared
Ott, Jennifer
7 / 22 shared
Rosta, Kawa
3 / 3 shared
Quliyeva, Ulviyya
1 / 6 shared
Mack, Iris
1 / 1 shared
Soldano, Caterina
1 / 3 shared
Pälikkö, Elmeri
1 / 1 shared
Garin, Moises
1 / 1 shared
Vahanissi, Ville
2 / 5 shared
Gadda, Akiko
1 / 1 shared
Juntunen, Mikko
1 / 2 shared
Repo, Paivikki
1 / 2 shared
Seppanen, Heli
1 / 1 shared
Garín, Moises
1 / 1 shared
Gädda, Akiko
1 / 12 shared
Gastrow, Guillaume Von
1 / 3 shared
Rauha, Ismo T. S.
1 / 4 shared
Pearce, Joshua
2 / 7 shared
Von Gastrow, Guillaume
1 / 3 shared
Heikkinen, Ismo T. S.
1 / 2 shared
Seppänen, Heli
1 / 6 shared
Repo, Päivikki
1 / 2 shared
Laine, Hannu
2 / 3 shared
Modanese, Chiara
2 / 4 shared
Theut, Nicholas
1 / 1 shared
Chart of publication period
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2022
2021
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2019
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2017

Co-Authors (by relevance)

  • Lehtiö, Juha Pekka
  • Isometsä, Joonas
  • Liu, Hanchen
  • Kokko, K.
  • Vähänissi, Ville
  • Savin, Hele
  • Leiviskä, Oskari
  • Laukkanen, P.
  • Fung, Tsun Hang
  • Miettinen, Mikko
  • Rad, Zahra Jahanshah
  • Liu, Xiaolong
  • Radfar, Behrad
  • Setälä, Olli E.
  • Serue, Michael
  • Heinonen, Juha
  • Chen, Kexun
  • Yli-Koski, Marko
  • Laukkanen, Pekka
  • Ott, Jennifer
  • Rosta, Kawa
  • Quliyeva, Ulviyya
  • Mack, Iris
  • Soldano, Caterina
  • Pälikkö, Elmeri
  • Garin, Moises
  • Vahanissi, Ville
  • Gadda, Akiko
  • Juntunen, Mikko
  • Repo, Paivikki
  • Seppanen, Heli
  • Garín, Moises
  • Gädda, Akiko
  • Gastrow, Guillaume Von
  • Rauha, Ismo T. S.
  • Pearce, Joshua
  • Von Gastrow, Guillaume
  • Heikkinen, Ismo T. S.
  • Seppänen, Heli
  • Repo, Päivikki
  • Laine, Hannu
  • Modanese, Chiara
  • Theut, Nicholas
OrganizationsLocationPeople

article

Compatibility of 3-D Printed Devices in Cleanroom Environments for Semiconductor Processing

  • Vähänissi, Ville
  • Savin, Hele
  • Gastrow, Guillaume Von
  • Rauha, Ismo T. S.
  • Pasanen, Toni P.
Abstract

3-D printing has potential to revolutionize manufacturing of customized low-cost scientific equipment, and numerous self-designed applications have already been realized and demonstrated. However, the applicability of 3-D printed devices to cleanrooms used for semiconductor processing is not as straightforward, as the controlled environment sets strict requirements for the allowed materials and items. This work investigates the opportunity to utilize 3-D printing in cleanrooms by analyzing three potentially suitable polymers (polylactic acid (PLA), acrylonitrile butadiene styrene (ABS) and polypropylene (PP)) for two applications that do not require particular chemical compatibility: a custom single wafer storage box and a wafer positioner for a metrology system. The designed equipment supplements commercial selection by introducing support for samples with non-standard shape or size and simultaneously reduces the price of often extensively expensive cleanroom equipment. The results show that the single wafer boxes 3-D printed from PLA and ABS generate as little particles as a commercial equivalent, whereas slightly more particles are found from a wafer stored in the self-printed PP box. Nevertheless, the number of particles on all wafers is in the same order of magnitude, indicating that 3-D printed boxes are not significant particle sources. The 3-D wafer positioner seems to cause a negligible particle increase on the manipulated wafer, while abrasion of the mechanical parts generate larger numbers of particles that may disperse in the environment. Regular cleaning of those parts is thus recommended, and applicability in a cleanroom environment will depend on the cleanliness constraints. Elemental analysis reveals that 3-D printed objects contain no other harmful metal impurities than those originating from colorants. Thus, 3-D printing filaments with natural color should be preferred for purposes, where metal contamination could be an issue, including semiconductor processing. Finally, 3-D printing filaments considered in this study are shown to be resistant to isopropanol and deionized water, which is critical for efficient cleaning for use of 3-D printed objects in cleanrooms. The results demonstrate that simple 3-D printed objects, such as wafer boxes or tweezers, are not notable contamination sources, and hence, are equally suitable for use in cleanrooms as the commercial equivalents.

Topics
  • impedance spectroscopy
  • polymer
  • semiconductor
  • elemental analysis