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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Nogita, Kazuhiro
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2021Microstructure Evolution of Ag/TiO2 Thin Filmcitations
- 2020Effect of Na and Cooling Rate on the Activation of Mg–Ni Alloys for Hydrogen Storagecitations
- 2016Critical properties of Cu6Sn5 in electronic devices: Recent progress and a reviewcitations
- 2013Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planescitations
- 2012A new phase in stoichiometric Cu6Sn5citations
- 2010Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfacecitations
- 2009Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substratescitations
- 2008Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces
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article
Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates
Abstract
The formation of intermetallic compounds (IMCs) at the solder-substrate interface is essential in the manufacturing of solder joints. In this study, the effect of Ni addition into Sn-Cu lead-free solders on mechanical properties of the IMCs formed at the interface between solder ball grid arrays (BGAs) and Cu substrates, which experienced multiple reflows, were investigated. The results from nanoindentation tests showed that elastic modulus and hardness of (Cu,Ni)(6)Sn(5) were higher than those of Cu(6)Sn(5). The hardnesses of (Cu,Ni)(6)Sn(5) were more scattered compared to those of Cu(6)Sn(5). which may be attributed to the crystallographic characteristics such as growth texture of the IMCs. (C) 2009 Elsevier B.V. All rights reserved.