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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Emadi, Fahimeh
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2024Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliabilitycitations
- 2024Contact Metallization Design for Low-Temperature Interconnects in MEMS Integrationcitations
- 2023Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristicscitations
- 2022Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bondingcitations
- 2022Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packagingcitations
- 2021Thermoelectric Characteristics of InAs Nanowire Networks Directly Grown on Flexible Plastic Substratescitations
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article
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
Abstract
Funding Information: This work has been funded by iRel40. iRel40 is a European co-funded innovation project that has been granted by the ECSEL Joint Undertaking (JU) under grant agreement No 876659 . The funding of the project comes from the Horizon 2020 research program and participating countries. National funding is provided by Germany, Austria, Belgium, Finland ( Innovation Funding Agency, Business Finland ), France, Italy, the Netherlands, Slovakia, Spain, Sweden, and Turkey. Publisher Copyright: © 2023 The Authors | openaire: EC/H2020/876659/EU//iRel40 ; The mechanical reliability of the future miniaturized interconnects is mainly governed by the intermetallic compounds such as Cu6Sn5. Alloyed Cu6Sn5 with various elements, including Co and In, have been introduced and attracted attention for different reasons, such as the enhancing mechanical reliability and lowering the bonding temperature. Hence, this work aimed to evaluate the microstructural and mechanical properties of Cu6Sn5-, Cu6(Sn,In)5-, (Cu,Co)6Sn5-, and (Cu,Co)6(Sn,In)5-interconnects. The grain size, grain orientation, and crystal structure of the pure and alloyed Cu6Sn5 phases were analyzed using electron backscatter diffraction. The results revealed that all the joints contained monoclinic and hexagonal crystal structures arbitrarily formed across the bond-line. Furthermore, the Cu6Sn5 grains exhibited random grain orientation and there was no discernible difference between the pure and alloyed Cu6Sn5 interconnects other than Cu6(Sn,In)5 grains elongated along the perpendicular direction to the bonding interface. However, it was found that alloying elements altered the grain sizes. In alloying refined and elongated the Cu6Sn5 grains while the Co alloying enlarged the Cu6Sn5 grains. The mechanical properties of the interconnects were examined using nanoindentation test. The results indicated that the hardness (H) and Young's modulus (Ei) values of Cu6Sn5 is increased with the alloying elements. (Cu,Co)6(Sn,In)5 showed the highest Ei/H value ...