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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Ratzker, Barak
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Publications (11/11 displayed)
- 2024MXene-CNC super performing composite films for flexible and degradable electronicscitations
- 2024The effect of coarse and fine Ti3SiC2 particle reinforcement in aluminum matrix compositescitations
- 2023MXene-Based Ceramic Nanocomposites Enabled by Pressure-Assisted Sinteringcitations
- 2023Exploring the capabilities of high-pressure spark plasma sintering (HPSPS)citations
- 2020Deformation in nanocrystalline ceramicscitations
- 2019Highly-doped Nd:YAG ceramics fabricated by conventional and high pressure SPScitations
- 2019Stress-enhanced dynamic grain growth during high-pressure spark plasma sintering of aluminacitations
- 2018Compression creep of copper under electric current studied by a spark plasma sintering (SPS) apparatuscitations
- 2018Transparent Polycrystalline Magnesium Aluminate Spinel Fabricated by Spark Plasma Sinteringcitations
- 2018High-pressure spark plasma sintering of silicon nitride with LiF additivecitations
- 2016Creep of polycrystalline magnesium aluminate spinel studied by an SPS apparatuscitations
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article
Compression creep of copper under electric current studied by a spark plasma sintering (SPS) apparatus
Abstract
<p>A spark plasma sintering (SPS) apparatus was successfully employed to perform uniaxial compressive creep tests on pure copper under a stress of 30 MPa in the 400–600 °C temperature range. By utilizing two different configurations, the creep experiments were conducted without or with a low-density pulsed direct electric current (~ 6–7 A/mm<sup>2</sup>) passing through the samples. It was found that under the influence of the applied electric current, the creep rate increased significantly, while the extent of the effect diminished with temperature. The apparent activation energy for creep with applied current decreased from 110 to 66 kJ/mol. This was attributed to the effect of current on the thermally-activated process and dislocations motion. No distinct evidence that the electric current affects the microstructure was observed.</p>