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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Nogita, Kazuhiro
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2021Microstructure Evolution of Ag/TiO2 Thin Filmcitations
- 2020Effect of Na and Cooling Rate on the Activation of Mg–Ni Alloys for Hydrogen Storagecitations
- 2016Critical properties of Cu6Sn5 in electronic devices: Recent progress and a reviewcitations
- 2013Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planescitations
- 2012A new phase in stoichiometric Cu6Sn5citations
- 2010Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfacecitations
- 2009Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substratescitations
- 2008Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces
Places of action
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article
Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes
Abstract
Cu6Sn5 is an important intermetallic compound (IMC) commonly formed during lead-free soldering. It is known that Cu6Sn5 exhibits significantly different thermo-mechanical deformation behaviour compared to both bulk solder alloys and their substrates. In high-density 3-D electrical packages individual solder joints may contain only a few grains of Cu6Sn5. The knowledge of the mechanical properties, creep and crack behaviour of Cu6Sn5 on different crystal planes is therefore essential to understanding the deformation of lead-free solder joints in service. In this research, the mechanical properties, creep and crack patterns on diverse crystal planes of hexagonal Cu6Sn5 and (Cu,Ni)(6)Sn-5 were investigated using electron back scattered diffraction (EBSD), scanning electron microscopy (SEM) and nanoindentation. It was found that the mechanical properties, creep and crack patterns of hexagonal Cu6Sn5 were strongly related to the crystal orientation. The addition of Ni was found to reduce the anisotropy in hardness and the creep of Cu6Sn5 and had a significant effect on the crack patterns of Cu6Sn5. (C) 2013 Elsevier B.V. All rights reserved.