| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Cohen, Sidney
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (29/29 displayed)
- 2023Guided Search to Self-Healing in Semiconductorscitations
- 2022Polymer Gel with Tunable Conductive Properties: A Material for Thermal Energy Harvesting
- 2022Electronic interactions and stability issues at the copper-graphene interface in air and in alkaline solution under electrochemical controlcitations
- 2019Oxygen vacancy ordering and viscoelastic mechanical properties of doped ceria ceramicscitations
- 2019A Nanoscopic View of Photoinduced Charge Transfer in Organic Nanocrystalline Heterojunctionscitations
- 2018Decoration of Inorganic Nanostructures by Metallic Nanoparticles to Induce Fluorescence, Enhance Solubility, and Tune Band Gapcitations
- 2018Microstructure and nanohardness of Ag and Ni under friction in boundary lubricationcitations
- 2018Self-Assembled Hybrid Materials Based on Organic Nanocrystals and Carbon Nanotubescitations
- 2017Self-supported Gd-doped ceria films for electromechanical actuationcitations
- 2015The gizzard plates in the Cephalaspidean gastropod Philine quadripartitacitations
- 2015Metal-organic microstructurescitations
- 2014Novel poly(3-hydroxybutyrate) nanocomposites containing WS2 inorganic nanotubes with improved thermal, mechanical and tribological propertiescitations
- 2013Osteonal lamellae elementary unitscitations
- 2013New deposition technique for metal films containing inorganic fullerene-like (IF) nanoparticlescitations
- 2013The Nature of Interfaces in Al-1050/Al-1050 and Al-1050/Mg-AZ31 Couples Joined by Magnetic Pulse Welding (MPW)citations
- 2012An international round-robin calibration protocol for nanoindentation measurementscitations
- 2012Influence of Gd content on the room temperature mechanical properties of Gd-doped ceriacitations
- 2012Zirconium vacuum arc operation in a mixture of Ar and O 2 gasescitations
- 2012Nanoindentation of osteonal bone lamellaecitations
- 2011Alleviating fatigue and failure of NiTi endodontic files by a coating containing inorganic fullerene-like WS2 nanoparticlescitations
- 2010Nanoindentation measurements and mechanical testing of as-soldered and aged Sn-0.7Cu lead-free miniature jointscitations
- 2010A novel experimental method for the local mechanical testing of human coronal dentincitations
- 2009Compressive response of dentin micro-pillarscitations
- 2007Microscopic investigation of shear in multiwalled nanotube deformationcitations
- 2007Insights into the Structure and Domain Flexibility of Full-Length Pro-Matrix Metalloproteinase-9/Gelatinase Bcitations
- 2006Sequence dependence of charge transport properties of DNAcitations
- 2004Non-crystalline pyroelectric BaTiO3 thin filmscitations
- 2001Nanoscale shear and indentation measurements in transcrystalline α-isotactic polypropylenecitations
- 2001Mechanics and dynamics of transcrystalline alpha-isotactic polypropylene at the nanoscale
Places of action
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article
Nanoindentation measurements and mechanical testing of as-soldered and aged Sn-0.7Cu lead-free miniature joints
Abstract
<p>Nanoindentation testing has been used to analyze local mechanical parameter changes across interfaces formed between the solder and the Cu substrate and also in the eutectic solder, in miniature lead-free soldered joints. Effects of plastic deformation and aging were investigated. The lead-free solder alloy used in this study is commercially available and has nominal composition by weight of 99.3% Sn and 0.7% Cu. During aging, the joints were exposed to 150°C for 1000h in an inert atmosphere. Tensile testing of as-soldered miniature joints shows strong positive dependence of the plastic flow stresses on strain rate, meaning that the stresses increase with strain rate. Similar behavior was observed for aged miniature soldered joints with ∼10% decrease in the level of maximum stresses, compared to as-soldered joints.Indentation hardness and modulus were measured in soldered joint components, in the as-soldered, aged conditions, and tensile tested with strain rates in the range of 1.8×10<sup>-3</sup>-1.8×10<sup>-1</sup>s<sup>-1</sup>. Scanning electron and optical microscopy were employed to analyze the fracture paths and microstructure of the as-soldered and aged miniature joints, as well as the location and shape of the indentations. The measured indentation hardness and modulus agreed well with previous studies on similar alloys. The tested modulus of the intermetallic phase in the eutectic area exhibited a considerable reduction as compared to the intermetallic phase at the interface between the solder and the Cu substrate. Strain rate strongly influences local mechanics: for both as-soldered and deformed miniature joints; close to the fracture face in the eutectic solder, the indentation modulus values were 53% higher and hardness more than 100% higher in joints exposed to the highest strain rate relative to the smallest rate.</p>