| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Feuchter, Michael
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2024Morphological structure and mechanical properties of a nucleated Polyoxymethylene (POM) homopolymer resin processed under conventional injection molding conditions
- 2024Impact Characteristics and Repair Approaches of Distinct Bio-Based Matrix Composites: A Comparative Analysiscitations
- 2024Effect of different weft-knitted structures on the mechanical performance of bio-based flexible compositescitations
- 2024Manufacturing bio-based fiber-reinforced polymer composites: Process performance in RTM and VARI processescitations
- 2023Impact of Multiple Reprocessing on Properties of Polyhydroxybutyrate and Polypropylenecitations
- 2023Tensile properties of flexible composites with knitted reinforcements from various yarn materialscitations
- 2023Investigation of the Mechanical Properties of Sandwich Composite Panels Made with Recyclates and Flax Fiber/Bio-Based Epoxy Processed by Liquid Composite Moldingcitations
- 2022Dynamic mechanical response in epoxy nanocomposites incorporating various nano-silica architectures
- 2022Towards virtually optimized curing cycles for polymeric encapsulations in microelectronicscitations
- 2022Injection Molding Simulation of Polyoxymethylene Using Crystallization Kinetics Data and Comparison with the Experimental Processcitations
- 2021Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
- 2021Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronicscitations
- 2020Exploiting the Carbon and Oxa Michael Addition Reaction for the Synthesis of Yne Monomerscitations
- 2018Influence of environmental factors like temperature and humidity on MEMS packaging materials.citations
Places of action
| Organizations | Location | People |
|---|
article
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Abstract
Surface Mounted Devices (SMDs) are widely used throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based encapsulations. Thus, enhanced lifetime assessment methods are necessary. To understand the stress situation in SMDs at the end of the production cycle, an improved model approach for the curing of EMC is implemented within Finite Element Analysis (FEA) simulations. During production, e.g., in a Resin Transfer Molding (RTM) process, material properties are spatially varying due to different curing degrees. Hence, a mismatch of mechanical properties is present, which in return leads to internal stresses. The introduced model approach is an extension of the work of Gschwandl et al. (2017) and includes a stress-free deformation before vitrification, changing material properties during curing, as well as plastic deformations and visco-elastic effects. The implementation in numerical FEA simulations allows for a better understanding of arising residual stresses and helps optimize the production cycle of SMDs.