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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Brincker, Mads
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2018Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallizationcitations
- 2018Comparative study of Al metallization degradation in power diodes under passive and active thermal cyclingcitations
- 2018Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnectscitations
- 2017Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnectscitations
- 2016Mechanisms of metallization degradation in high power diodescitations
- 2015Effects of thermal cycling on aluminum metallization of power diodescitations
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article
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects
Abstract
<p>Transient liquid phase (TLP) bonding is one of novel techniques, which is an alternative to conventional soldering used in power electronics packaging. In this paper, we report on the formation and analysis of TLP bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo systems for production of hybrid metal baseplates. The obtained bonds of intermetallic compounds are characterised by shear testing, optical microscopy and energy dispersive X-ray spectroscopy. Cu-Sn-Mo systems show low bond strength due to severe void and crack formation while Cu-Sn-Ag-Mo interfaces demonstrate high homogeneity and considerable shear strength. Thus, it is concluded that the low temperature TLP bonding using Cu-Sn-Ag-Mo can be a promising candidate for the fabrication of hybrid Cu-Mo baseplates. However, deeper studies of thermal reliability of these systems are required.</p>