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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Dalverny, Olivier
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (22/22 displayed)
- 2023Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditionscitations
- 2022In Situ Ageing with the Platform Preheating of AlSi10Mg Alloy Manufactured by Laser Powder-Bed Fusion Processcitations
- 2019Experimental SAC305 shear stress-strain hysteresis loop construction using Hall's one-dimensional model based on strain gages measurementscitations
- 2019Analysis of the multilayer woven fabric behaviour during the forming process: focus on the loss of cohesion within the woven fibre network
- 2018Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cyclingcitations
- 2018Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cyclingcitations
- 2018Sensitivity analysis of composite forming process parameters using numerical hybrid discrete approach
- 2018Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurementscitations
- 2018Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurementscitations
- 2017An algorithm for damage detection and localization Usibg output-only response for civil engineering structures subjected to seismic excitations
- 2017An algorithm for damage detection and localization using output-only response for civil-engineering structures subjected to seismic excitation
- 2017Analysis of the multilayer woven fabric behaviour during the forming process. Focus on the loss of cohesion within the woven fibre network.
- 2017Analysis of the multilayer woven fabric behaviour during the forming process. Focus on the loss of cohesion within the woven fibre network
- 2016Experimental study of 48600 Carbons fabrics behavior using marks tracking technique method
- 2015Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applicationscitations
- 2015Experimental and Numerical Study of Interfacial Fracture Parameters of a Brazed Joints
- 2012Identification of orthotropic material properties using displacement field measurements
- 2012Non destructive investigation of defects in composite structures by three infrared thermographic techniques
- 2012Micromechanical modeling of brittle damage in composite materials: primary anisotropy, induced anisotropy and opening-closure effects
- 2008Modélisation des assemblages de ballons pressurisés stratosphériques
- 20042D and 3D numerical models of metal cutting with damage effectscitations
- 2002Transient Numerical Models of Metal Cutting using the Johnson-Cook's Rupture Criterion.citations
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article
Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling
Abstract
Temperature-induced solder joint fatigue is a main reliability concern for aerospace and military industries whose electronic equipment used in the field is required to remain functional under harsh loadings. Due to the RoHS directive which eventually will prevent lead from being utilized in electronic systems, there is a need for a better understanding of lead-free thermomechanical behavior when subjected to temperature variations. As solder joints mechanical properties are dependent of their microstructural characteristics, developing accurate solder joint fatigue models means to correctly capture the microstructural changes that undergo the solder alloy during thermal cycling. This study reports the Sn3.0Ag0.5Cu (SAC305) solder joints microstructural evolution during damaging temperature cycles. Electron BackScatter Diffraction (EBSD) analysis was conducted to assess the SAC305 microstructure corresponding to a specific damage level. Investigated microstructural features included the β-Sn grain size and crystallographic orientation, as well as the grain boundary misorientation and Ag3Sn intermetallic compound (IMC) size. As-reflowed and damaged components were also mechanically characterized using nanoindentation technique. The microstructural analysis of SAC305 solder joints prior to thermal cycling showed a highly textured microstructure characteristic of hexa-cyclic twinning with two β-Sn morphologies consisting of preferentially orientated macrograins known as Kara's beach ball, along with smaller interlaced grains. The main observation is that recrystallization systematically occurred in SAC305 solder joints during thermal cycling, creating a high population of misoriented grain boundaries leading to intergranular crack initiation and propagation in the high strain regions. The recrystallization process is accompanied with a progressive loss of crystallographic texture and twinning structure. Ag3Sn IMCs coalescence is another strong indicator of SAC305 solder damage since the bigger and more spaced the IMCs are the less dislocation pinning can prevent recrystallization from occurring.