| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Kristensen, Peter Kjær
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Topics
Publications (14/14 displayed)
- 2024Metal-organic framework-intercalated graphene oxide nanofiltration membranes for enhanced treatment of wastewater effluentscitations
- 2024Metal-organic framework-intercalated graphene oxide nanofiltration membranes for enhanced treatment of wastewater effluentscitations
- 2023Magnetron Sputter Deposition of Nanostructured AlN Thin Filmscitations
- 2022Interfacial adhesion strength of III-N heterostructurescitations
- 2018Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallizationcitations
- 2018Comparative study of Al metallization degradation in power diodes under passive and active thermal cyclingcitations
- 2018Optical characterization of SiC films grown on Si(111)
- 2018Optical characterization of SiC films grown on Si(111)
- 2018Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnectscitations
- 2016Mechanisms of metallization degradation in high power diodescitations
- 2015Effects of thermal cycling on aluminum metallization of power diodescitations
- 2015Nonfouling tunable βCD dextran polymer films for protein applicationscitations
- 2014Deposition of thin ultrafiltration membranes on commercial SiC microfiltration tubescitations
- 2013Influence of Two Compatibilizers on Clay/PP Nanocomposites Propertiescitations
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article
Mechanisms of metallization degradation in high power diodes
Abstract
Under operation the topside metallization of power electronic chips is commonly observed to degrade and thereby affecta device's electrical characteristics. However, the mechanisms of the degradation process and the role of environmental factors are not yet fully understood. In this work, we investigate the metallization degradation by passive thermal cycling of unpackaged high-power diode chips in different controlled atmospheres. The electrical degradation of the metallization is characterized by sheet resistance measurements, while the microstructural damage is investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). To study the evolution of the chemical composition of the metallization, energy dispersive X-ray spectroscopy (EDX) is also applied. Since the degradation depends on the initial microstructure of the metallization, the film texture and grain size distribution is determined using electron backscatter diffraction (EBSD). The obtained data show that the type of atmosphere plays a minor role in the degradation process, with a slight tendency that cycling in dry nitrogen atmosphere accelerates the degradation compared to the experiments in ambient atmosphere with a controlled relative humidity of 50 and 95%.