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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Dell, John
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2017Large-Area MEMS Tunable Fabry-Perot Filters for Multi/Hyperspectral Infrared Imagingcitations
- 2016Preparation and characterization of cerium substituted bismuth dysprosium iron garnets for magneto-optic applicationscitations
- 2015Investigation of ICPECVD Silicon Nitride Films for HgCdTe Surface Passivationcitations
- 2014Characterization of mechanical, optical and structural properties of bismuth oxide thin films as a write-once medium for blue laser recordingcitations
- 2014Characterization of mechanical, optical and structural properties of bismuth oxide thin films as a write-once medium for blue laser recording
- 2014Investigation of cerium-substituted europium iron garnets deposited by biased target ion beam depositioncitations
- 2014GaSb: A new alternative substrate for epitaxial growth of HgCdTecitations
- 2011Thermally induced damages of PECVD SiNx thin filmscitations
- 2007Dielectric thin films for MEMS-based optical sensorscitations
- 2007Poisson's Ratio of Low-Temperature PECVD Silicon Nitride Thin Filmscitations
- 2007Process condition dependence of mechanical and physical properties of silicon nitride thin filmscitations
- 2006Thermal Stability of PECVD SiN/sub x/ Filmscitations
- 2006Effect of oxidation on the chemical bonding structure of PECVD SiN thin filmscitations
- 2006Stress in low-temperature plasma enhanced chemical vapour deposited silicon nitride thin filmscitations
- 2005Characterization of Mechanical Properties of Silicon Nitride Thin Films for MEMS Devices by Nanoindentation
- 2005Effects of deposition temperature on the mechanical and physical properties of silicon nitride thin filmscitations
- 2005Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry-Perot optical filterscitations
- 2005Evaluation of Plasma Deposited Silicon Nitride Thin Flims for Microsystems Technologycitations
- 2004Laser-Beam-Induced Current Mapping of Spatial Nonuniformities in Molecular Beam Epitaxy As-Grown HgCdTecitations
- 2004Dark Currents in Long Wavelength Infrared HgCdTe Gated Photodiodescitations
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article
Dielectric thin films for MEMS-based optical sensors
Abstract
Nanoindentation and optical measurements have been employed in order to investigate the mechanical properties of low-temperature (50-330 degrees C) plasma-enhanced chemical vapour deposited (PECVD) SiNx as well as thermally evaporated SiOx, and Ge thin films for applications in micro-electro-mechanical systems (MEMS) fabricated on temperature sensitive, non-standard substrates. The temperature of the SiN, deposition process is found to strongly influence Young's modulus, hardness, and stress, with a critical deposition temperature in the 100 degrees C to 150 degrees C range which depends on the details of other deposition conditions such as chamber pressure and RF-power. The properties of PECVD SiN, films deposited above this critical temperature are found to be suitable for MEMS applications, whereas films deposited at lower temperatures exhibit low Young's modulus and hardness, as well as environment-induced stress instabilities. The investigated thin films have been incorporated into a monolithic integrated technology comprising low-temperature (-125 degrees C) MEMS and HgCdTe IR detectors, in order to realize successful prototypes of tuneable IR microspectrometers. (C) 2007 Elsevier Ltd. All rights reserved.