| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Mølhave, Kristian S.
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2024Microheater Controlled Crystal Phase Engineering of Nanowires Using In Situ Transmission Electron Microscopycitations
- 2024Microheater Controlled Crystal Phase Engineering of Nanowires Using In Situ Transmission Electron Microscopycitations
- 2024Operando Electron Microscopy and Impedance Analysis of Solid Oxide Electrolysis and Fuel Cellscitations
- 2021Development of high-temperature electrochemical TEM and its application on solid oxide electrolysis cells
- 2021Initiation and Progression of Anisotropic Galvanic Replacement Reactions in a Single Ag Nanowirecitations
- 2020Complex Aerosol Characterization by Scanning Electron Microscopy Coupled with Energy Dispersive X-ray Spectroscopycitations
- 2018Influence of Cetyltrimethylammonium Bromide on Gold Nanocrystal Formation Studied by in Situ Liquid Cell Scanning Transmission Electron Microscopycitations
- 2017Direct bonding of ALD Al2O3 to silicon nitride thin filmscitations
- 2016Controlling nanowire growth through electric field-induced deformation of the catalyst dropletcitations
- 2016In-Situ Transmission Electron Microscopy on Operating Electrochemical Cells
- 2016Effect of Synthesis Parameters on the Structure and Magnetic Properties of Magnetic Manganese Ferrite/Silver Composite Nanoparticles Synthesized by Wet Chemistry Methodcitations
- 2015Feasibility of the development of reference materials for the detection of Ag nanoparticles in food: neat dispersions and spiked chicken meatcitations
- 2011Titanium tungsten coatings for bioelectrochemical applications
- 2010Customizable in situ TEM devices fabricated in freestanding membranes by focused ion beam millingcitations
- 2008Epitaxial Integration of Nanowires in Microsystems by Local Micrometer Scale Vapor Phase Epitaxycitations
- 2003Soldering of Nanotubes onto Microelectrodescitations
- 2003Solid gold nanostructures fabricated by electron beam depositioncitations
- 2001Customizable nanotweezers for manipulation of free-standing nanostructurescitations
Places of action
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article
Direct bonding of ALD Al2O3 to silicon nitride thin films
Abstract
Direct bonding is an advanced joining technique for bonding of silicon based surfaces at low temperature without any specific surface pretreatment. The main purpose of this work is to develop new techniques to enhance the fabrication process for nanofluidic systems for in situ transmission electron microscopy (TEM) by improving low temperature annealing bonding strength when using atomic layer deposition of aluminum oxide. We have investigated and characterized bonding of Al<sub>2</sub>O<sub>3</sub>-Si<sub>x</sub>N<sub>y</sub> (low stress silicon rich nitride) and Al<sub>2</sub>O<sub>3</sub>-Si<sub>3</sub>N<sub>4 </sub>(stoichiometric nitride) thin films annealed from room temperature up to 600 degrees C without pretreatment prior to the pre bonding. We find that bonding of Al<sub>2</sub>O<sub>3</sub>-Si<sub>x</sub>N<sub>y</sub> and Al<sub>2</sub>O<sub>3</sub>-Si<sub>3</sub>N<sub>4</sub> is favorable in a temperature range from room temperature to 600 °C. We report bonding strength of 1300±150 mJ/m<sup>2</sup> comparable to and in some case even higher than that of other materials Al<sub>2</sub>O<sub>3</sub> can be bonded to. Preliminary tests demonstrating a well-defined nanochannel system with-100 nm high channels successfully bonded and tests against leaks using optical fluorescence technique and transmission electron microscopy (TEM) characterization of liquid samples are also reported. Moreover, the current bonding method can be also used for further MEMS applications.