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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Le, Thanh Hung
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Topics
Publications (11/11 displayed)
- 2019Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloycitations
- 2017Efficient p-n junction-based thermoelectric generator that can operate at extreme temperature conditionscitations
- 2017Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatmentcitations
- 2016On the Challenges of Reducing Contact Resistances in Thermoelectric Generators Based on Half-Heusler Alloyscitations
- 2016On the Challenges of Reducing Contact Resistances in Thermoelectric Generators Based on Half-Heusler Alloyscitations
- 2016Effects of spark plasma sintering conditions on the anisotropic thermoelectric properties of bismuth antimony telluridecitations
- 2016Scandium-doped zinc cadmium oxide as a new stable n-type oxide thermoelectric materialcitations
- 2013The Influence of α- and γ-Al 2 O 3 Phases on the Thermoelectric Properties of Al-doped ZnOcitations
- 2013The Influence of α- and γ-Al2O3 Phases on the Thermoelectric Properties of Al-doped ZnOcitations
- 2012High-temperature segmented thermoelectric oxide module using p-type Ca3Co4O9 and n-type ZnAlO/CaMn0.95Nb0.05O3 legs
- 2012High-temperature segmented thermoelectric oxide module using p -type Ca 3 Co 4 O 9 and n -type ZnAlO/CaMn 0.95 Nb 0.05 O 3 legs
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article
Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy
Abstract
ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 ᵒC). To obtain high performance, these devices require stable and low resistance contacts between thermoelectric materials and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy. We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved.