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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Malik, Safdar Abbas
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (3/3 displayed)
- 2019Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloycitations
- 2018Contacts and Interface Evolution in Thermoelectric Modules
- 2017Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatmentcitations
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article
Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy
Abstract
ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 ᵒC). To obtain high performance, these devices require stable and low resistance contacts between thermoelectric materials and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy. We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved.