| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Green, Mark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (15/15 displayed)
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2021Investigating conjugated polymer nanoparticle formulations for lateral flow immunoassayscitations
- 2020High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticlescitations
- 2019Anisotropic Plasmonic CuS Nanocrystals as a Natural Electronic Material with Hyperbolic Optical Dispersioncitations
- 2017Post-polymerization C–H Borylation of Donor–Acceptor Materials Gives Highly Efficient Solid State Near-Infrared Emitters for Near-IR-OLEDs and Effective Biological Imagingcitations
- 2015One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2014One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2013Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additivescitations
- 2012Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reactioncitations
- 2012Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substratescitations
- 2011Bond strength of CFRP and steel bars in concrete at elevated temperature
- 2010Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates citations
- 2008Electrical behavior of memory devices based on fluorene-containing organic thin filmscitations
- 2004Self propagating high temperature synthesis of magnesium zinc ferrites (MgxZn1-xFe2O3): Thermal imaging and time resolved X-ray diffraction experimentscitations
Places of action
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article
High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles
Abstract
By using a novel in situ reduction-sintering process, the native oxide on Cu nanoparticle surface wasremoved and obvious oxide was not found even after sintering in air. Pressureless sintering at 220 °C for 5 min resulted in a high joint shear strength of over 30 MPa. The growth of oxide on Cu nanoparticle<br/>surfaces during storage was studied and the level of oxide film that hinders sintering was also determined. The consolidation behavior of Cu nanoparticles during sintering was observed. The results show that the sintering density of Cu nanoparticles peaked after only 5 min and the formation of dislocations were<br/>observed in the sintered structure after prolonged heating times.