| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Graves, John
Coventry University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (16/16 displayed)
- 2023Soldering tip and method
- 2023Selective soldering nozzles
- 2023Analysis of Pre-Treatment Processes to Enable Electroplating on Nitrided Steel
- 2023The challenges in selective soldering and meeting training needs
- 2023Braze head and method
- 2022Thiourea Leachingcitations
- 2021Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)citations
- 2020The effects of turmeric on the grain structure and properties of copper electrodeposited composites
- 2018Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodepositioncitations
- 2018Selective metallization of non-conductive materials by patterning of catalytic particles and the application of a gradient magnetic fieldcitations
- 2018Additive process for patterned metallized conductive tracks on cotton with applications in smart textilescitations
- 2018Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic fieldcitations
- 2014Functionalised copper nanoparticles as catalysts for electroless platingcitations
- 2013Ultrasonically enabled low temperature electroless plating for advanced electronic manufacture
- 2012Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacturecitations
- 2001The use of insoluble anodes in acid sulphate copper electrodeposition solutionscitations
Places of action
| Organizations | Location | People |
|---|
article
Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field
Abstract
The formation of printed circuit patterns on non-conductive substrates has many applications in high 7 value sectors such as the electronics sector. Current semi-additive and subtractive circuit 8 manufacturing processes use photolithography to pattern substrates coated with a thin or relatively 9 thick metal film. This process is often wasteful and expensive. Using an innovative approach; 10 composite Fe3O4-Ag nanoparticles were synthesized and attracted to a magnetic field. The 11 nanoparticles catalysed electroless copper deposition. Such a catalyst is new to electroless plating and 12 was deposited selectively on a dielectric substrate using a gradient magnetic field. In this way, 13 subsequent electroless copper plating occurred exclusively where the magnetic field was applied, 14 whilst the remaining surface was free of deposited metal. The advantage of this additive method of 15 manufacture is that less material is needed and less waste is produced.