693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Cobley, Andrew
Coventry University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (38/38 displayed)
- 2023Selective soldering nozzles
- 2023Analysis of Pre-Treatment Processes to Enable Electroplating on Nitrided Steel
- 2023The challenges in selective soldering and meeting training needs
- 2021Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)citations
- 2020The effects of turmeric on the grain structure and properties of copper electrodeposited composites
- 2020MATUROLIFE: Using Advanced Material Science to Develop the Future of Assistive Technologycitations
- 2018Ultrasound assisted electroless nickel-boron plating from alkaline borohydride bath
- 2018Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodepositioncitations
- 2018Selective metallization of non-conductive materials by patterning of catalytic particles and the application of a gradient magnetic fieldcitations
- 2018Additive process for patterned metallized conductive tracks on cotton with applications in smart textilescitations
- 2018Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic fieldcitations
- 2017Electroless deposition of nickel-boron coatings using low frequency ultrasonic agitation: Effect of ultrasonic frequency on the coatings.citations
- 2017Electroless deposition of nickel-boron coatings using low frequency ultrasonic agitation: Effect of ultrasonic frequency on the coatings properties and the deposition of electroless Ni-B composite.
- 2016Properties of electroless Ni-B-WC composite coatings
- 2016Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatingscitations
- 2016The Effect of Mixing and Degassing Conditions on the Properties of Epoxy/Anhydride Resin System
- 2016Bismuth-based composite coating for overlay applications in plain bearings
- 2015Ultrasound-assisted electrodeposition of thin Nickel-based composite coatings with lubricant particlescitations
- 2015Effect of additive concentration during copper deposition using EnFACE electrolytecitations
- 2015Ultrasonic agitation in barrel electroplating: field trial resultscitations
- 2014Functionalised copper nanoparticles as catalysts for electroless platingcitations
- 2014Ultrasound-assisted electrodeposition of composite coatings with particlescitations
- 2013Ultrasonically enabled low temperature electroless plating for advanced electronic manufacture
- 2012Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacturecitations
- 2012Initial studies to optimise the sonochemical surface modification of a high Tg laminatecitations
- 2012The use of ultrasound to enable low temperature electroless platingcitations
- 2011Initial studies into the use of ultrasound to reduce process temperatures and chemical usage in the PCB desmear processcitations
- 2010Eurointerfinish 2009citations
- 2010Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticlescitations
- 2009Electroless methods
- 2008Improved Electroless Copper Composition
- 2006Catalytic anodes for electrodepositioncitations
- 2006Use of organic reductants to lower brightener consumption in acid copper electroplating bath utilising catalytic anodescitations
- 2004Method For Desmearing Resin Accretions And Texturing Resin Without Using Solvent
- 2003Characterisation of insoluble anodes for acid copper electrodepositioncitations
- 2003The effect of insoluble anodes on the process control and deposit quality of acid copper electroplating bathscitations
- 2001Methods for achieving high speed acid copper electroplating in the PCB industrycitations
- 2001The use of insoluble anodes in acid sulphate copper electrodeposition solutionscitations
Places of action
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article
Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodeposition
Abstract
Pulsed current (PC) electrodeposition has become an essential tool for producing coatings in a wide range of industries. The pulsed current can have a significant influence on the composition, morphology and properties of electrodeposited coatings and this is particularly true when plating an alloy. In this study, the mechanism for the development of Sn-Cu alloy coatings produced by PC electrodeposition was investigated. Sn-Cu alloy coatings produced by PC electrodeposition were essentially composed of a dual layer of Sn-Cu electrodeposits and Cu6Sn5 inter metallic compounds (IMCs). In addition, it was observed that pulsed Sn-Cu electrodeposits exhibited an increased Cu content. Experiments were carefully designed to elucidate the mechanism for this important finding and based on their results a theory is proposed which explains the increased Cu content in terms of a metal displacement reaction occurring during the ‘relaxation’ time of PC electrodeposition.