Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2004Delayed failure behaviour of the ESIS silicon nitride reference material at 1200 °C in air2citations

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Lube, Tanja
1 / 8 shared
Danzer, R.
1 / 10 shared
Dusza, J.
1 / 14 shared
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2004

Co-Authors (by relevance)

  • Lube, Tanja
  • Danzer, R.
  • Dusza, J.
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article

Delayed failure behaviour of the ESIS silicon nitride reference material at 1200 °C in air

  • Lube, Tanja
  • Danzer, R.
  • Kovalcík, J.
  • Dusza, J.
Abstract

<p>The aim of the present contribution was to study the delayed failure of a commercially available Si<sub>3</sub>N<sub>4</sub>. Static flexure tests at different stresses (150, 200, and 300 MPa) were carried out at 1200 °C in air. The strain and the lifetime of the specimens were recorded, and fracture surfaces were investigated. In all specimens, some creep deformation occurred (more at lower stresses). At the lowest stress, some indication for creep damage (multiple crack growth) could be detected. The lifetime of the specimens is proportional to an inverse power of the applied stress. The stress exponent was determined as n = 7. The low value of this exponent is an evidence that a long-time use of the material at high mechanical loads is only possible at temperatures below 1200 °C. The work was done in the frame of the European Structural Integrity Society (ESIS) Technical Committee for Ceramics (TC6) Reference Material Testing Program (RMTP).</p>

Topics
  • impedance spectroscopy
  • surface
  • crack
  • nitride
  • Silicon
  • creep
  • electrospray ionisation