| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Borodin, Elijah
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2024Discrete modelling of continuous dynamic recrystallisation by modified Metropolis algorithmcitations
- 2024Triple junction disclinations in severely deformed Cu-0.4%Mg alloyscitations
- 2024Discrete model for discontinuous dynamic recrystallisation applied to grain structure evolution inside adiabatic shear bandscitations
- 2024Defect-induced fracture topologies in Al 2 O 3 ceramic-graphene nanocomposites
- 2024Defect-induced fracture topologies in Al2O3 ceramic-graphene nanocomposites
- 2023Topological characteristics of grain boundary networks during severe plastic deformations of copper alloyscitations
- 2021Triple junctions network as the key pattern for characterisation of grain structure evolution in metalscitations
- 2021Optimisation of rGO-enriched nanoceramics by combinatorial analysiscitations
- 2020Evolution of triple junctions’ network during severe plastic deformation of copper alloys – a discrete stochastic modellingcitations
- 2019Experimental and numerical analyses of microstructure evolution of Cu-Cr-Zr alloys during severe plastic deformationcitations
- 2017Grain refinement kinetics in a low alloyed Cu-Cr-Zr alloy subjected to large strain deformationcitations
- 2015Kinetic model for mechanical twinning and its application for intensive loading of metals
Places of action
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article
Triple junctions network as the key pattern for characterisation of grain structure evolution in metals
Abstract
Describing dynamic recrystallisation processes is challenging with the existing limited set of material characterisation tools. This creates potential barriers to further developments in grain boundary engineering. We consider the network of triple junctions in copper alloys as a critical structure governing continuous dynamic recrystallisation and propose a related structural entropy parameter. With the limited available characterisation data we demonstrate that this parameter describes well the evolution of the microstructure during severe plastic deformation. Importantly, with the help of this parameter micro-localisation features in copper alloys observed in some recent experiments can be elucidated.