Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Coventry University

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (6/6 displayed)

  • 2024EBSD characterization of graphene nano sheet reinforced Sn–Ag solder alloy composites5citations
  • 2024EBSD characterization of Ag3Sn phase transformation in Sn–Ag lead-free solder alloys2citations
  • 2024Small-angle neutron scattering analysis in Sn-Ag Lead-free solder alloys1citations
  • 2024Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag3Sn Phase2citations
  • 2023Synthesis and characterisation of graphene-reinforced AA 2014 MMC using squeeze casting method for lightweight aerospace structural applications24citations
  • 2020Experimental Investigations on Impact Toughness and Shear Strength of Novel Lead Free Solder Alloy Sn-1Cu-1Ni-XAgcitations

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Chart of shared publication
Pazhani, Ashwath
5 / 27 shared
Chandrasekharan, Vishnu Kizhavallil
1 / 2 shared
Ambi, Abhishek
1 / 1 shared
Robi, P. S.
1 / 1 shared
Tg, Unnikrishnan
2 / 2 shared
Unnikrishnan, T. G.
1 / 1 shared
Honecker, Dirk
1 / 28 shared
Kadavath, Gokulnath
1 / 1 shared
Amer, Mohamed
1 / 5 shared
Patel, Nikunj
1 / 1 shared
Moganraj, Arivarasu
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Batako, Andre
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Paulsamy, Jeyapandiarajan
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Xavior, M. Anthony
1 / 18 shared
Anbalagan, Arivazhagan
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Jayaseelan, Joel
1 / 3 shared
Venkatraman, M.
1 / 4 shared
Elias, Jacob
1 / 1 shared
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2024
2023
2020

Co-Authors (by relevance)

  • Pazhani, Ashwath
  • Chandrasekharan, Vishnu Kizhavallil
  • Ambi, Abhishek
  • Robi, P. S.
  • Tg, Unnikrishnan
  • Unnikrishnan, T. G.
  • Honecker, Dirk
  • Kadavath, Gokulnath
  • Amer, Mohamed
  • Patel, Nikunj
  • Moganraj, Arivarasu
  • Batako, Andre
  • Paulsamy, Jeyapandiarajan
  • Xavior, M. Anthony
  • Anbalagan, Arivazhagan
  • Jayaseelan, Joel
  • Venkatraman, M.
  • Elias, Jacob
OrganizationsLocationPeople

article

Small-angle neutron scattering analysis in Sn-Ag Lead-free solder alloys

  • Pazhani, Ashwath
  • Honecker, Dirk
  • Kadavath, Gokulnath
  • Shanthi Bhavan, Jayesh
Abstract

<p>This study addresses the critical need for lead-free solder alternatives in electronic manufacturing by investigating the microstructural characteristics of Sn-Ag solder alloys, focusing on the Ag<sub>3</sub>Sn intermetallic phase. Utilizing Small-Angle Neutron Scattering (SANS), the study explored the phase interface and grain structure within Sn-Ag alloy to identify attributes that influence mechanical stability and performance. The research was structured around a comprehensive SANS analysis, complemented by Electron Backscatter Diffraction (EBSD) to expose the morphology and orientation of crystalline phases within the material. The investigation revealed distinct scattering patterns indicative of a multi-phase structure with a homogeneous distribution of fine Ag<sub>3</sub>Sn precipitates within a β-Sn matrix. EBSD data confirmed these findings, showing a wide range of grain sizes and a random orientation distribution that matches theoretical models for polycrystalline materials. Notably, the SANS data uncovered a specific size distribution of the Ag<sub>3</sub>Sn phase, which was characterized by a sharp interface contrast against the β-Sn matrix, pivotal for understanding the solder's mechanical properties. Interpretation of the SANS and EBSD data sets suggests that the Sn-Ag alloy's performance is significantly influenced by the dispersion and morphology of the Ag<sub>3</sub>Sn phase. The presence of nanoscale Ag<sub>3</sub>Sn structures, exhibiting a needle-like surface, implies a material optimized for mechanical reinforcement, which is essential for robust electronic connections. The integrated approach offers a novel perspective on the nano structural arrangement of lead-free solders, contributing to the advancement of safer, more reliable electronic materials. The findings have significant implications for the development of next-generation electronic components, reinforcing the transition to environmentally benign manufacturing processes.</p>

Topics
  • impedance spectroscopy
  • dispersion
  • surface
  • grain
  • grain size
  • crystalline phase
  • precipitate
  • random
  • electron backscatter diffraction
  • intermetallic
  • small-angle neutron scattering