Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2010Investigation of Cu coatings deposited by kinetic metallization15citations

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Spencer, K.
1 / 7 shared
Muddle, B. C.
1 / 2 shared
Birbilis, N.
1 / 15 shared
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2010

Co-Authors (by relevance)

  • Spencer, K.
  • Muddle, B. C.
  • Birbilis, N.
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article

Investigation of Cu coatings deposited by kinetic metallization

  • Spencer, K.
  • Muddle, B. C.
  • Han, Y. K.
  • Birbilis, N.
Abstract

Interfacial characterisation of Kinetic Metallization (KM) sprayed Cu coatings applied on metal substrates was performed using optical and electron microscopy, as well as microindentation hardness testing and microchemical analysis. The interfacial characterisation of KM coatings remains scarce to date. Cross sectional observations of KM coatings on light metal substrates revealed an undulating, patelliform profile with thin-lipped cusps at the interface. Pure Al and Mg substrates exhibited a mechanically impinged zone <~5 μm on the substrate material, approximately the size of deformed Cu powder particles. Examination of the Cu side of the interface indicated there was no long range interaction in the coating. On the substrate side of the interface, the KM process induced phase transformations (i.e. recrystallisation and an alloyed zone) in thin layers contiguous to the interface on pure Al and Mg substrates. Zones of elemental interdiffusion were identified at the interface upon Al and Mg substrates using scanning TEM. The width of intermixing zones was in the vicinity of < 1 μm. This metallurgical interaction at the interface occurred on the length scales involving the initial single layer of Cu particles bonded on the substrate. © 2010 Elsevier Inc.

Topics
  • phase
  • hardness
  • transmission electron microscopy
  • interfacial
  • interdiffusion
  • hardness testing