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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Mukherjee, Partha P.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2024Dendrite Growth—Microstructure—Stress—Interrelations in Garnet Solid‐State Electrolytecitations
- 2024Alumina - Stabilized SEI and CEI in Potassium Metal Batteries.citations
- 2024Operando Investigation on the Role of Densification and Chemo‐Mechanics on Solid‐State Cathodescitations
- 2024Mechanical Milling – Induced Microstructure Changes in Argyrodite LPSCl Solid‐State Electrolyte Critically Affect Electrochemical Stabilitycitations
- 2023Tuned Reactivity at the Lithium Metal–Argyrodite Solid State Electrolyte Interphasecitations
- 2023Structural and electrochemical evolution of alloy interfacial layers in anode-free solid-state batteriescitations
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article
Structural and electrochemical evolution of alloy interfacial layers in anode-free solid-state batteries
Abstract
<p>“Anode-free” solid-state batteries feature high energy density since there is no anode active material. Although the beneficial effects of interfacial layers at the anode-solid electrolyte interface have been demonstrated, the mechanisms through which they influence lithium plating/stripping are unclear. Here, we reveal the evolution of 100-nm silver and gold interfacial layers during lithium plating/stripping using electrochemical methods, electron microscopy, X-ray microcomputed tomography, and modeling. The alloy layers improve Coulombic efficiency and resistance to short circuiting, even though the alloys form solute regions or particulates that detach from the current collector during plating. In situ electrochemical impedance spectroscopy shows that the alloys return to the interface and mitigate contact loss at the end of stripping, avoiding a critical vulnerability of anode-free cells. Contact retention is driven by even Li thickness that promotes spatially uniform stripping, as well as local alloy delithiation in response to current concentrations that homogenizes current and diminishes voiding.</p>