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| Ertürk, Emre |
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| Petrov, R. H. | Madrid |
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| Azevedo, Nuno Monteiro |
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| Rignanese, Gian-Marco |
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Nazeri, Muhammad Firdaus Mohd
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Topics
Publications (9/9 displayed)
- 2022Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heatingcitations
- 2021Microstructure and Phase Investigation of Sn-58Bi-xCu Lead-Free Solder After Immersion in Sodium Chloride Solution
- 2021Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite soldercitations
- 2020Corrosion Investigation of Sn-0.7Cu Pb-Free Solder in Open-Circuit and Polarized Conditionscitations
- 2020Selective etching and hardness properties of quenched SAC305 solder jointscitations
- 2020Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etchingcitations
- 2019Corrosion characterization of Sn-Zn solder: a review
- 2019Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acidcitations
- 2019Investigation on Passivation Behavior of Sn- 0.7Cu Solder in Different Polarizing Conditions
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article
Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heating
Abstract
Microwave hybrid heating (MHH) is a possible approach for soldering; yet, the long-term reliability of solder joints is still unclear. In this work, a comparative study was carried out on the influence of isothermal aging on SAC305/Cu solder joints by conventional reflow and MHH. The conventional reflow oven was set to 260 °C at 60 s holding time, and MHH was carried out at high operating power at 40 s. The reflowed sample was isothermally aged at 150 °C for various aging times (0, 240, 480 and 960 h) in a laboratory oven. The conventional reflow and MHH transformed the IMC structure from scallop-like to a planar-like Cu6Sn5 with a linear increase in thickness and a thin layer of Cu3Sn was observed at 240 h of aging. While Ag3Sn particles grew larger at longer aging time. The MHH shows a thinner Cu6Sn5 layer, and a smaller grain size compared to conventional reflow. The ultimate tensile strength (UTS) for conventional reflow (32.7 MPa) is 26.8% lower compared to MHH (44.7 MPa). The UTS for MHH is greater than conventional reflow as the isothermal aging time increases.