| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Marcoen, Kristof
Vrije Universiteit Brussel
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (33/33 displayed)
- 2024Molecular Layer Deposition of Zeolitic Imidazolate Framework-8 Filmscitations
- 2024Application of operando ORP-EIS for the in-situ monitoring of acid anion incorporation during anodizingcitations
- 2024Effect of heat treatment on the microstructure and pitting corrosion behavior of 316L stainless steel fabricated by different additive manufacturing methods (L-PBF versus L-DED): Comparative investigation exploring the role of microstructural features on passivitycitations
- 2023Revealing the Role of Electrolyte Salt Decomposition in the Structural Breakdown of LiNi0.5Mn1.5O4citations
- 2023Identification of carbon‐containing phases in electrodeposited hard Fe–C coatings with intentionally codeposited carbon
- 2023Molecular Layer Deposition of Zeolitic Imidazolate Framework-8 Filmscitations
- 2023Molecular Layer Deposition of Zeolitic Imidazolate Framework-8 Filmscitations
- 2023Molecular Layer Deposition of Zeolitic Imidazolate Framework-8 Filmscitations
- 2023Identification of carbon-containing phases in electrodeposited hard Fe–C coatings with intentionally codeposited carbon
- 2023Investigation of hybrid Zr-aminosilane treatment formation on zinc substrate and comparison to advanced high strength stainless steelcitations
- 2022Electrochemical codeposition of copper-antimony and interactions with electrolyte additives: towards the use of electronic waste for sustainable copper electrometallurgycitations
- 2022Unraveling the mechanism of the conversion treatment on Advanced High Strength Stainless Steels (AHSSS)citations
- 2022Electrochemical codeposition of arsenic from acidic copper sulfate baths : the implications for sustainable copper electrometallurgycitations
- 2022Unraveling the formation mechanism of hybrid Zr conversion coating on advanced high strength stainless steelscitations
- 2021A study of the interfacial chemistry between polymeric methylene diphenyl di-isocyanate and a Fe-Cr alloycitations
- 2021Electrochemical codeposition of arsenic from acidic copper sulfate baths: the implications for sustainable copper electrometallurgycitations
- 2021Effect of Sr Addition to a Modified AA3003 on Microstructural and Corrosion Propertiescitations
- 2021Effect of Sr Addition to a Modified AA3003 on Microstructural and Corrosion Propertiescitations
- 2020Molecular Characterization of Bonding Interactions at the Buried Steel Oxide-Aminopropyl Triethoxysilane Interface Accessed by Ar Cluster Sputteringcitations
- 2020ToF-SIMS characterization of the interfacial molecular chemistry in metal (active) corrosion protection systems based on organic coatings
- 2020Effect of excess hydrogen bond donors on the electrode-electrolyte interface between choline chloride-ethylene glycol based solvents and coppecitations
- 2020Integrated cleanroom process for the vapor-phase deposition of large-area zeolitic imidazolate framework thin filmscitations
- 2020Molecular Characterization of Multiple Bonding Interactions at the Steel Oxide - Aminopropyl triethoxysilane Interface by ToF-SIMScitations
- 2020Molecular Characterization of Multiple Bonding Interactions at the Steel Oxide-Aminopropyl triethoxysilane Interface by ToF-SIMScitations
- 2019Electrode-electrolyte interactions in choline chloride ethylene glycol based solvents and their effect on the electrodeposition of ironcitations
- 2019Dual Role of Lithium on the Structure and Self-Healing Ability of PMMA-Silica Coatings on AA7075 Alloycitations
- 2019The chemical throwing power of lithium-based inhibitors from organic coatings on AA2024-T3citations
- 2019Integrated Cleanroom Process for the Vapor-Phase Deposition of Large-Area Zeolitic Imidazolate Framework Thin Filmscitations
- 2019An integrated cleanroom process for the vapor-phase deposition of large-area zeolitic imidazolate framework thin filmscitations
- 2018Compositional study of a corrosion protective layer formed by leachable lithium salts in a coating defect on AA2024-T3 aluminium alloyscitations
- 2018Fluoride-Induced Interfacial Adhesion Loss of Nanoporous Anodic Aluminium Oxide Templates in Aerospace Structurescitations
- 2017Unravelling the chemical influence of water on the PMMA/aluminum oxide hybrid interface in situcitations
- 2017Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl)(1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Propertiescitations
Places of action
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article
Effect of excess hydrogen bond donors on the electrode-electrolyte interface between choline chloride-ethylene glycol based solvents and coppe
Abstract
<p>The fine tuning of deep eutectic solvents (DES) via the addition of co-solvents such as water or excess ethylene glycol, to improve the electrodeposition of metals is becoming increasingly common. However, as these changes become commonplace, our understanding of their effect must deepen as well. In this work, we look into how water, a secondary hydrogen bond donor (HBD), added to choline chloride:ethylene glycol (1:2 ChCl:EG) DES changes the electrochemical behaviour of the solution. We use time-of-flight secondary ion mass spectrometry (ToF-SIMS) to identify and map the organic molecules that have interacted with the surface. A copper surface was used as an electrochemically active substrate. The molecular maps provide insights into how solvent composition changes electrolyte reactivity, as well as showing the main driver behind the entrapment of organic compounds in metal deposits from DES. This behaviour was studied at different potentials based on the information provided by linear sweep voltammetry data of the copper in the solution. These results are then contrasted against a 1:4 ChCl:EG solution, where the excess ethylene glycol acts as secondary HBD, in order to determine the individual contributions of the co-solvents and how they affect the electrochemistry of the media and their reactions with the copper electrode. This information can be used as a set of guidelines for the tuning and optimisation of ethylene glycol based DES for metal deposition.</p>