| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Karthikeyan, Vaithinathan
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (17/17 displayed)
- 20242D MXene Interface Engineered Bismuth Telluride Thermoelectric Module with Improved Efficiency for Waste Heat Recoverycitations
- 2023Facile composite engineering to boost thermoelectric power conversion in ZnSb devicecitations
- 2023Facile composite engineering to boost thermoelectric power conversion in ZnSb devicecitations
- 20233D Architectural MXene‐based Composite Films for Stealth Terahertz Electromagnetic Interference Shielding Performancecitations
- 2023Dispersion of InSb Nanoinclusions in Cu<sub>3</sub>SbS<sub>4</sub> for Improved Stability and Thermoelectric Efficiencycitations
- 2023Dispersion of InSb nanoinclusions in Cu3SbS4 for improved stability and thermoelectric efficiencycitations
- 20233D architectural MXene composite films for stealth terahertz shielding performancecitations
- 2022Hierarchically Interlaced 2D Copper Iodide/MXene Composite for High Thermoelectric Performancecitations
- 2022Hierarchically interlaced 2D copper iodide/MXene composite for high thermoelectric performancecitations
- 2022Insights into the classification of nanoinclusions of composites for thermoelectric applicationscitations
- 2022Amorphous carbon nano-inclusions for strategical enhancement of thermoelectric performance in Earth-abundant Cu3SbS4citations
- 2022Probing the Effect of MWCNT Nanoinclusions on the Thermoelectric Performance of Cu3SbS4 Compositescitations
- 2022Thermoelectric properties of sulfide and selenide-based materialscitations
- 2022Insights into the Classification of Nanoinclusions of Composites for Thermoelectric Applicationscitations
- 2022Probing the effect of MWCNT nanoinclusions on the thermoelectric performance of Cu3SbS4 compositescitations
- 2020A comparative evaluation of physicochemical properties and photocatalytic efficiencies of cerium oxide and copper oxide nanofluidscitations
- 2019Influence of nitrogen dopant source on the structural, photoluminescence and electrical properties of ZnO thin films deposited by pulsed spray pyrolysiscitations
Places of action
| Organizations | Location | People |
|---|
article
Amorphous carbon nano-inclusions for strategical enhancement of thermoelectric performance in Earth-abundant Cu3SbS4
Abstract
Cu<sub>3</sub>SbS<sub>4</sub> is an effective, low cost and non-toxic thermoelectric compound for intermediate temperature applications. However, its tetragonal structure needs to be tuned for efficient phonon scattering to reduce thermal conductivity and enhance zT. In this present article, the semiconductive carbon black nano-inclusions effect on Cu<sub>3</sub>SbS<sub>4</sub> thermoelectric performance is studied. The thermoelectric properties of the fabricated samples are investigated in the temperature range of 300–623 K. Addition of amorphous carbon nano-inclusions in Cu<sub>3</sub>SbS<sub>4</sub> causes a reduction in the thermal conductivity by phonon scattering and improvement in the Seebeck coefficient by carrier energy filtering mechanisms. The maximum figure of merit of 0.51 is obtained for 3 mol.% carbon nano-inclusion sample at 623 K. Additionally, enhancement of thermal stability and mechanical stability (hardness) with increased carbon nano-inclusion concentration is observed. It is found that grain boundary hardening and dispersion strengthening are the reasons for the enhancement. Moreover, our detailed studies demonstrate that the addition of carbon nano-inclusions in Cu<sub>3</sub>SbS<sub>4</sub> can produce efficient, non-toxic, and inexpensive state-of-the-art thermoelectric devices.