Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Mannan, Samjid Hassan

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King's College London

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (29/29 displayed)

  • 2020High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles35citations
  • 2019Influence of Zn concentration on interfacial intermetallics during liquid and solid state reaction of hypo and hypereutectic Sn-Zn solder alloys3citations
  • 2019Arresting High-Temperature Microstructural Evolution inside Sintered Silver3citations
  • 2017Review of silver nanoparticle based die attach materials for high power/temperature applications197citations
  • 2016Microstructural evolution of sintered silver at elevated temperatures29citations
  • 2016Reactions in electrodeposited Cu/Sn and Cu/Ni/Sn nanoscale multilayers for interconnects29citations
  • 2016Thermally stable high temperature die attach solution25citations
  • 2015Electromigration Phenomena in Sintered Nanoparticle Ag Systems Under High Current Densitycitations
  • 2015Factors influencing microstructural evolution in nanoparticle sintered Ag die attach3citations
  • 2014A review: On the development of low melting temperature Pb-free solders402citations
  • 2013Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives8citations
  • 2012Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders22citations
  • 2012Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction19citations
  • 2012Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates108citations
  • 2010Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates 50citations
  • 2009Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling19citations
  • 2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects6citations
  • 2007Dissolution and interfacial reaction of Nb in contact with the molten 521n-48Sn solder15citations
  • 2007Failure mechanisms of dummy IGBT assembles constructed using liquid In-Sn/Nb systemcitations
  • 2006Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects199citations
  • 2006Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies8citations
  • 2006Edge effects in intermetallic compound crystal growth between Nb and molten 52In-48Sn soldercitations
  • 2005Study of intermetallic crystal growth between Nb and molten 52In-48Sn solder12citations
  • 2004Materials and processes for implementing high-temperature liquid interconnects54citations
  • 2004Dissolution of solids in contact with liquid solder16citations
  • 2002Electroless nickel bumping of aluminum bondpads - Part II: Electroless nickel plating23citations
  • 2000Solder paste reflow modeling for flip chip assemblycitations
  • 2000Investigation of a solder bumping technique for flip-chip interconnectioncitations
  • 2000Under bump metallisation of fine pitch flip-chip using electroless nickel deposition8citations

Places of action

Chart of shared publication
Zuo, Yang
1 / 1 shared
Carter-Searjeant, Sadie
1 / 1 shared
Green, Mark
5 / 15 shared
Mills, Liam
1 / 2 shared
Kotadia, Hiren R.
4 / 8 shared
Das, Amit
1 / 18 shared
Sano, Naoko
1 / 1 shared
Khtatba, Khalid Mohd Abdalla
2 / 2 shared
Qutaish, Hamzeh
1 / 1 shared
Paknejad, Seyed Amir
6 / 7 shared
Zoubi, Tariq
1 / 1 shared
Parijs, Linde Van
1 / 1 shared
Greenberg, Julian
1 / 2 shared
Mansourian, Ali
4 / 5 shared
Khtatba, Khalid
2 / 3 shared
Chia, Pay Ying
1 / 1 shared
Haseeb, A. S. M. A.
1 / 7 shared
Noh, Yohan
1 / 2 shared
Qiannan, Wen
1 / 1 shared
Zayats, Anatoly V.
1 / 18 shared
Parijs, L. Van
1 / 1 shared
Khtatba, K.
1 / 1 shared
Noh, Y.
1 / 1 shared
Howes, Philip D.
1 / 1 shared
Sugden, Mark W.
1 / 1 shared
Steen, Hector
1 / 1 shared
Ashayer, Roya
1 / 1 shared
Roshanghias, Ali
1 / 5 shared
Kokabi, Amir H.
1 / 1 shared
Khomamizadeh, Farzad
1 / 2 shared
Clode, Michael P.
1 / 1 shared
Miodownik, Mark
1 / 2 shared
Mokhtari, Omid
1 / 1 shared
Mokhtari, O.
3 / 6 shared
Kotadia, H. R.
3 / 6 shared
Clode, M. P.
9 / 9 shared
Bottrill, M.
1 / 1 shared
Clode, Michael Paul
1 / 1 shared
Amirmajdi, Omid Mokhtari
1 / 1 shared
Ashyer-Soltani, Roya
1 / 1 shared
Wang, Yunqi
1 / 1 shared
Cabruja, Enric
1 / 1 shared
Pellegrini, Giulio
1 / 2 shared
Hutt, David A.
1 / 2 shared
Whalley, David C.
1 / 1 shared
Liu, Chongqing
1 / 1 shared
Conway, Paul P.
1 / 3 shared
Chen, Keming
1 / 1 shared
Clode, Mike P.
1 / 1 shared
Li, Jianfeng
1 / 6 shared
Crossley, A.
1 / 15 shared
Johnston, C.
1 / 16 shared
Li, J. F.
5 / 5 shared
Hute, D. A.
1 / 1 shared
Whalley, D. C.
6 / 13 shared
Clodel, M. P.
1 / 1 shared
Sarvar, F.
1 / 1 shared
Hutt, D. A.
4 / 6 shared
Dagher, M.
1 / 1 shared
Conway, P. P.
4 / 6 shared
Liu, C. Q.
1 / 1 shared
Bailey, C.
1 / 5 shared
Rhodes, D. G.
1 / 1 shared
Holmes, A. S.
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Liu, C.
1 / 47 shared
Chart of publication period
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2012
2010
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Co-Authors (by relevance)

  • Zuo, Yang
  • Carter-Searjeant, Sadie
  • Green, Mark
  • Mills, Liam
  • Kotadia, Hiren R.
  • Das, Amit
  • Sano, Naoko
  • Khtatba, Khalid Mohd Abdalla
  • Qutaish, Hamzeh
  • Paknejad, Seyed Amir
  • Zoubi, Tariq
  • Parijs, Linde Van
  • Greenberg, Julian
  • Mansourian, Ali
  • Khtatba, Khalid
  • Chia, Pay Ying
  • Haseeb, A. S. M. A.
  • Noh, Yohan
  • Qiannan, Wen
  • Zayats, Anatoly V.
  • Parijs, L. Van
  • Khtatba, K.
  • Noh, Y.
  • Howes, Philip D.
  • Sugden, Mark W.
  • Steen, Hector
  • Ashayer, Roya
  • Roshanghias, Ali
  • Kokabi, Amir H.
  • Khomamizadeh, Farzad
  • Clode, Michael P.
  • Miodownik, Mark
  • Mokhtari, Omid
  • Mokhtari, O.
  • Kotadia, H. R.
  • Clode, M. P.
  • Bottrill, M.
  • Clode, Michael Paul
  • Amirmajdi, Omid Mokhtari
  • Ashyer-Soltani, Roya
  • Wang, Yunqi
  • Cabruja, Enric
  • Pellegrini, Giulio
  • Hutt, David A.
  • Whalley, David C.
  • Liu, Chongqing
  • Conway, Paul P.
  • Chen, Keming
  • Clode, Mike P.
  • Li, Jianfeng
  • Crossley, A.
  • Johnston, C.
  • Li, J. F.
  • Hute, D. A.
  • Whalley, D. C.
  • Clodel, M. P.
  • Sarvar, F.
  • Hutt, D. A.
  • Dagher, M.
  • Conway, P. P.
  • Liu, C. Q.
  • Bailey, C.
  • Rhodes, D. G.
  • Holmes, A. S.
  • Liu, C.
OrganizationsLocationPeople

article

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates

  • Clode, M. P.
  • Green, Mark
  • Mokhtari, O.
  • Mannan, Samjid Hassan
  • Kotadia, H. R.
Abstract

<p>The effect of adding 0.5-1.5 wt.% Zn to Sn-3.8Ag-0.7Cu (SAC) solder alloy during reflow and solid state ageing has been investigated. In particular, the role of the Zn addition in suppressing interfacial Intermetallic Compound (IMC) growth on Cu and Ni-P substrates has been determined. Solder-substrate couples were aged at 150 degrees C and 185 degrees C for 1000 h. In the case of 0.5-1.0 wt.% Zn on Cu substrate, Cu3Sn IMC was significantly suppressed and the morphology of Cu6Sn5 grains was changed, leading to suppressed Cu6Sn5 growth. In the SAC-1.5Zn/Cu substrate system a Cu5Zn8 IMC layer nucleated at the interface followed by massive spalling of the layer into the solder, forming a barrier layer limiting Cu6Sn5 growth. On Ni-P substrates the (Cu,Ni)(6)Sn-5 IMC growth rate was suppressed, the lowest growth rate being found in the SAC-1.5Zn/Ni-P system. In all cases the added Zn segregated to the interfacial IMCs so that Cu6Sn5 became (Cu,Zn)(6)Sn-5 and (Cu,Ni)(6)Sn-5 became (Ni,Cu,Zn)(6)Sn-5. The effect of Zn concentration on undercooling, wetting angles and IMC composition changes during ageing are also tabulated, and a method of incorporating Zn into the solder during reflow without compromising solder paste reflow described. (C) 2011 Elsevier B.V. All rights reserved.</p>

Topics
  • morphology
  • compound
  • grain
  • forming
  • aging
  • intermetallic
  • interfacial