| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Green, Mark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (15/15 displayed)
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2022Conformational Heterogeneity and Interchain Percolation Revealed in an Amorphous Conjugated Polymercitations
- 2021Investigating conjugated polymer nanoparticle formulations for lateral flow immunoassayscitations
- 2020High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticlescitations
- 2019Anisotropic Plasmonic CuS Nanocrystals as a Natural Electronic Material with Hyperbolic Optical Dispersioncitations
- 2017Post-polymerization C–H Borylation of Donor–Acceptor Materials Gives Highly Efficient Solid State Near-Infrared Emitters for Near-IR-OLEDs and Effective Biological Imagingcitations
- 2015One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2014One-pot aqueous synthesis of highly strained CdTe/CdS/ZnS nanocrystals and their interactions with cells
- 2013Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additivescitations
- 2012Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reactioncitations
- 2012Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substratescitations
- 2011Bond strength of CFRP and steel bars in concrete at elevated temperature
- 2010Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates citations
- 2008Electrical behavior of memory devices based on fluorene-containing organic thin filmscitations
- 2004Self propagating high temperature synthesis of magnesium zinc ferrites (MgxZn1-xFe2O3): Thermal imaging and time resolved X-ray diffraction experimentscitations
Places of action
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article
Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates
Abstract
<p>The effect of adding 0.5-1.5 wt.% Zn to Sn-3.8Ag-0.7Cu (SAC) solder alloy during reflow and solid state ageing has been investigated. In particular, the role of the Zn addition in suppressing interfacial Intermetallic Compound (IMC) growth on Cu and Ni-P substrates has been determined. Solder-substrate couples were aged at 150 degrees C and 185 degrees C for 1000 h. In the case of 0.5-1.0 wt.% Zn on Cu substrate, Cu3Sn IMC was significantly suppressed and the morphology of Cu6Sn5 grains was changed, leading to suppressed Cu6Sn5 growth. In the SAC-1.5Zn/Cu substrate system a Cu5Zn8 IMC layer nucleated at the interface followed by massive spalling of the layer into the solder, forming a barrier layer limiting Cu6Sn5 growth. On Ni-P substrates the (Cu,Ni)(6)Sn-5 IMC growth rate was suppressed, the lowest growth rate being found in the SAC-1.5Zn/Ni-P system. In all cases the added Zn segregated to the interfacial IMCs so that Cu6Sn5 became (Cu,Zn)(6)Sn-5 and (Cu,Ni)(6)Sn-5 became (Ni,Cu,Zn)(6)Sn-5. The effect of Zn concentration on undercooling, wetting angles and IMC composition changes during ageing are also tabulated, and a method of incorporating Zn into the solder during reflow without compromising solder paste reflow described. (C) 2011 Elsevier B.V. All rights reserved.</p>