| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Schlegel, Stephan
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Topics
Publications (10/10 displayed)
- 2023Verhalten von Clinchverbindungen bei Belastung mit hohen Kurzzeitströmen
- 2023Investigations on the Heat Transfer between an Electrical Heating Rod and a Rail for Heated Railway Switch Pointscitations
- 2023Diffusion of Silver in Liquid Tin Depending on the Temperature Gradient Along the Solder in Low-Voltage Power Fuses at Overcurrents
- 2022Self-lubricating coatings for high-current connectors
- 2022Electrical Contacting of Aluminum Bus Bars Using Clinching and Functional Elements †citations
- 2022Long-Term Behavior of Clinched Electrical Contactscitations
- 2022Investigations on the influence of mechanical and thermal load on the clamping force of heating rod clamps
- 2021Synthesis and structural analysis of intermetallic compounds in electrical connectionscitations
- 2017Effect of dispersoids on long-term stable electrical aluminium connectionscitations
- 2011Langzeitverhalten von Schraubenverbindungen mit Stromschienen aus Reinkupfer in der Elektroenergietechnik unter besonderer Berücksichtigung der Temperatur
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article
Synthesis and structural analysis of intermetallic compounds in electrical connections
Abstract
<p>The components used in electrical power engineering may undergo different aging mechanisms. For some material combinations, this includes interdiffusion processes together with the formation of intermetallic compounds (IMC). As for some IMCs only few or inconsistent data regarding growth parameters or electrical properties at temperatures below 200 °C exist, it is challenging to estimate their influence on the durability of electrical components. In a series of research projects, for the systems aluminium-copper (Al-Cu), aluminium-silver (Al-Ag), silver-tin (Ag-Sn) and nickel-tin (Ni-Sn) data on the formation and growth parameters were gathered. For this, the IMCs forming at temperatures below 200 °C were identified, synthesised and structurally and electrically characterised. Parallelly, industrial samples like busbars or fuse elements were analysed and the growth behaviour and rates of the IMCs were determined. For Al-Cu, three IMCs (Al<sub>2</sub>Cu, AlCu and Al<sub>4</sub>Cu<sub>9</sub>) and for Ag-Al, two IMCs (Ag<sub>2</sub>Al and Ag<sub>3</sub>Al) could be identified. In Ag-Sn specimens, two IMCs (Ag<sub>3</sub>Sn and Ag<sub>4</sub>Sn) could be detected. Below 200 °C, Ni-Sn shows one IMC from the phase diagram (Ni<sub>3</sub>Sn<sub>4</sub>) and a second platelet shaped IMC which can be described as tetragonal NiSn<sub>3</sub>. From the electrical properties and the growth rates of the IMCs together with the results of long-term tests it can be concluded, that the influence of IMCs on the overall life-cycle and electrical resistance is not significant.</p>